For time resolved hot carrier emission from the backside, an alternate approach is demonstrated termed single point PICA. The single point approach records time resolved emission from an individual transistor using time-correlated-single-photon counting and an avalanche photo-diode. The avalanche photo-diode has a much higher quantum efficiency than micro-channel plate photo-multiplier tube based imaging cameras typically used in earlier approaches. The basic system is described and demonstrated from the backside on a ring oscillator circuit.

A new tool (Schlumberger IDS 2000) has become available for acquiring waveforms from C4 (also known as flip chip) packaged IC’s. The waveform acquisition technique is based on electro-optic sampling through the backside of silicon. After explaining the physics of electro-optic sampling, the technique is demonstrated through the backside of Si on a simple diode test structure and a flip chip microprocessor. Also, many of the issues and challenges with this tool are discussed.