This paper aims to discuss the processes involved in establishing a more rapid approach in exposing the polyfuse and thin film fuse using the reactive ion etching, chemical deprocessing and parallel lapping techniques. The results proved that parallel lapping technique in combination with chemical deprocessing and reactive ion etching is a faster approach in exposing the physical status of the fuses.

This paper describes how scanning acoustic microscopy can be used to inspect materials under the chamfer of electronic device packages. The technique involves the use of copper tape to locate the areas affected by the chamfer during X-ray radiography. The results are then correlated with known critical package and assembly geometries to determine how far parallel lapping should proceed to ensure that the areas of interest will become observable under acoustic microscopy without interfering with the functionality of the device.