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1-7 of 7
Marc van Veenhuizen
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Proceedings Papers
ISTFA2024, ISTFA 2024: Conference Proceedings from the 50th International Symposium for Testing and Failure Analysis, 292-296, October 28–November 1, 2024,
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This paper discusses the application of the RF-LIT technique to a variety of use cases. The technique itself was introduced during last year’s ISTFA 2023 conference. The present work aims to showcase its suitability for the analysis of polyline cracks and packaging related fails such as via opens in RDL as well as cracks in solder joints. Further, a model is constructed explaining why RF-LIT can work and where the frequency dependence comes from.
Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 238-242, November 12–16, 2023,
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This paper discusses a method to observe open traces with the LIT. An overview is given of FA techniques capable of localizing high Ohmic fails. It is discussed how a wire can be made observable with LIT by injecting an AM modulated RF carrier signal. The electrical stimulus is described that excites the device and triggers the LIT. Results that demonstrate the capability of the technique are presented for several devices and the findings are evaluated.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 369-373, October 30–November 3, 2022,
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Failure analysis engineers apply a combination of conventional static fault isolation tools such as OBIRCH, PEM, or lock-in thermography (LIT) to detect simple short defects. However, if the defect is located in a complex circuit, analysis can be more challenging. Laser voltage probing and imaging (LVx) is widely used but will have difficulty in localizing a defect in the backend layers. The combination of LVx and LIT can resolve complex short cases that either of these techniques alone cannot easily do. This paper introduces the thermal effect of LVx and applications of LIT for functional analysis, and it describes and provides case histories for complementary fault isolation procedures for detecting defects in metal layers and transistors.
Proceedings Papers
ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 253-260, November 15–19, 2020,
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Lock-in techniques enable the detection of very small signals in a background that can be dominated by noise. This strength makes these techniques valuable especially for failure analysis of active devices where the deviation may be difficult to detect. This paper describes novel use case applications in which the lock-in amplifier plays a key role. The case studies covered are multi-frequency mapping fault isolation with nonperiodic patterns and frequency resonance measurement of a micro electro-mechanical system (MEMS) gyroscope. The paper presents how lock-in amplifiers enable digital failure analysis using compressed scan patterns. It reports on using a lock-in to characterize a MEMS gyroscope and on how to directly observe the gyroscope motion using phase laser voltage imaging/electro-optical frequency mapping. It can be concluded that the lock-in techniques form an essential part of the failure analysis toolkit and will only be more so with this study.
Proceedings Papers
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 99-103, November 10–14, 2019,
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High numerical aperture (NA) laser scanning for fault localization requires the use of special lenses aimed at creating a tightly focused laser spot within an integrated circuit. Typically, extrinsic solid immersion lenses are employed that optimize the refraction at the air-silicon surface. In this feasibility study we investigate with both simulations and experiments the use of integrated diffraction lenses for high-NA imaging. We take the limit to ultrathin silicon and discuss the implications for the lens design and performance.
Proceedings Papers
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 168-172, November 10–14, 2019,
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Laser-based dynamic analysis has become a very important tool for analyzing advanced process technology and complex circuit design. Thus, many good reference papers discuss high resolution, high sensitivity, and useful applications. However, proper interpretation of the measurement is important as well to understand the failure behavior and find the root cause. This paper demonstrates this importance by describing two insightful case studies with unique observations from laser voltage imaging/laser voltage probing (LVP), optical beam induced resistance change, and soft defect localization (SDL) analysis, which required an in-depth interpretation of the failure analysis (FA) results. The first case is a sawtooth LVP signal induced by a metal short. The second case, a mismatched result between an LVP and SDL analysis, is a good case of unusual LVP data induced by a very sensitive response to laser light. The two cases provide a good reference on how to properly explain FA results.
Proceedings Papers
ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 272-281, November 6–10, 2016,
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We report on the use of Fresnel lenses in the failure analysis (FA) of actual failures. The design parameters affecting the performance of Fresnel lenses in terms of resolution, magnification, and field of view have been analyzed. It is demonstrated that the magnification depends linearly on the change in focus distance caused by the lens, normalized by the silicon thickness. The focus distance shift that can be obtained with the Fresnel lens is observed to saturate, whose root-cause remains to be investigated. The field of view is shown to increase with the silicon thickness and, to a lesser extent, with the number of lens rings. It has also been shown that these lenses are robust against patterning distortions. The OBIRCh responses of actual device failures before and after lens placement have been compared, demonstrating clearly the increase in magnification, resolution, and the ability to focus light which all translate into a better electrical fault isolation. All in all, this study proves the usefulness of Fresnel lenses for FA purposes and offers clear guidelines that will facilitate proper lens design.