By combining transmission electron microscopy (TEM) [1] with scanning capacitance microscopy (SCM) [2], it is possible to enhance our understanding of device failures. At Sandia, these complementary techniques have been utilized for failure analysis in new product development, process validation, and yield enhancement, providing unique information that cannot be obtained with other analytical tools. We have previously used these instruments to identify the root causes of several yield-limiting defects in CMOS device product lines [3]. In this paper, we describe in detail the use of these techniques to identify electrically active silicon dislocations in failed SRAMs and to study the underlying leakage mechanisms associated with these defects.