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1-4 of 4
M. Shafkat
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Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2024) 26 (3): 14–24.
Published: 01 August 2024
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This article describes a proposed novel metric to furnish chip designers with a prognostic tool for x-ray imaging in the pre-silicon stage. This metric is fashioned to provide designers with a concrete measure of how visible the fine-pitched features of their designs are under x-ray inspection. It utilizes a combination of x-ray image data collection, analysis, and simulations to evaluate different design elements.
Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 323-328, November 12–16, 2023,
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Antenna-in-packaging (AiP) enables the next generation of high-performance wireless 5G mmWave communication and beyond by incorporating antenna arrays in small form factors using System in Package (SiP) technology. The trend toward heterogeneous integration and advanced packaging will likely introduce more complexity to the semiconductor supply chain. In addition, there is also the risk of becoming more susceptible to security vulnerabilities associated with advanced packaging. This paper provides an overview of the supply chain vulnerabilities in advanced packaging and heterogeneous integration, followed by the existing security, reliability issues, and assurance of AiP. Apart from discussing existing physical modalities of AiP assurance and vulnerabilities, we propose Radio Frequency Fingerprint (RFF) as a new physical modality for AiP assurance. We also discuss possible future research direction and application of RFF in AiP assurance.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2022) 24 (4): 22–29.
Published: 01 November 2022
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This article describes how physical attacks can be launched on different types of nonvolatile memory (NVM) cells using failure analysis tools. It explains how the bit information stored inside these devices is susceptible to read-out and fault injection attacks and defines vulnerability parameters to help quantify risks associated with different modalities of attack. It also presents an in-depth security analysis of emerging NVM technologies and discusses potential countermeasures.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 217-224, October 30–November 3, 2022,
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Probing and imaging techniques that are conventionally used for failure analysis pose a major threat to the confidentiality and the integrity of data stored in non-volatile memory (NVM) cells integrated into a silicon chip. These techniques fall under the umbrella of physical attacks, which unlock tremendous capabilities for an attacker trying to access secret information stored in a target NVM. How vulnerable an NVM cell is to these attacks depends on device physics and the operational principles of the memory cell. The wide range of emerging NVM technologies opens new opportunities for attackers. Without significant attention to these emerging threats, confidential data stored in NVMs can get compromised without much effort, given access to advanced failure analysis tools. We aim to show how attackers can use their knowledge of how a memory device works to find out a suitable probing or imaging modality to extract the stored secret.