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1-4 of 4
M. Selim Unlu
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Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 28-32, November 9–13, 2014,
Abstract
View Papertitled, Resolution Improvement through Sparse Image Reconstruction Techniques for Dark Field Subsurface Microscopy of Integrated Circuits
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for content titled, Resolution Improvement through Sparse Image Reconstruction Techniques for Dark Field Subsurface Microscopy of Integrated Circuits
Sparse image reconstruction techniques have been used to recover high frequency information lost during the acquisition process in different imaging domains, such as ultrasound, synthetic aperture radar, optical microscopy, and astronomical and microscopic imaging. In this work, a signal processing framework is proposed to estimate the Point Spread Function (PSF) of the dark-field subsurface microscopy system from observation data. This PSF is incorporated into an image reconstruction framework, which can be formulated with two different image reconstruction techniques, regularized image reconstruction and dictionary-based image reconstruction. It is observed that both techniques provide at least 12% resolution improvement; lines with 224 nm spacing were localized after resolution improvement while lines with 252 nm spacing are at the limit of localization in experimental data. However, dictionary-based image reconstruction provides higher edge resolution and maintains the homogeneity of the intensity within the structures.
Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 293-295, November 9–13, 2014,
Abstract
View Papertitled, Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips
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for content titled, Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips
The demand for high resolution has raised interest for the use of aplanatic solid immersion lenses (aSIL) for backside optical inspection and failure analysis of integrated circuits due to its high numerical aperture capability. This work investigates the performance of aSIL microscopy in imaging of fully depleted silicon on insulator (SOI) chips and explores the effect of the buried oxide (BOx) thickness on the spatial resolution and photon collection efficiency. Three different cases, namely, bulk silicon, SOI with an ultrathin BOx of 10 nm, and SOI with a standard BOx thickness of 145 nm, are studied. It is observed that there is a 15% drop in the collection efficiency for ultra-thin BOx compared to bulk silicon and up to 80% decrease in the collection efficiency and 30% increase in the spot-size for standard Box.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2014) 16 (2): 26–32.
Published: 01 May 2014
Abstract
View articletitled, Integrated Circuit Super-Resolution Failure Analysis with Solid Immersion Lenses
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for article titled, Integrated Circuit Super-Resolution Failure Analysis with Solid Immersion Lenses
Researchers at Boston University have made significant improvements in the resolution that can be achieved with backside imaging techniques. In this article, they explain how they optimize lateral and longitudinal resolution of IR-based methods using aplanatic solid immersion lenses in combination with adaptive optics that correct for aberrations, interferometry to improve signal-to-noise ratios, vortex beams that overcome diffraction limitations, and image reconstruction techniques based on prior knowledge about the objects under investigation.
Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 551-556, November 11–15, 2012,
Abstract
View Papertitled, Image Reconstruction Techniques for High Numerical Aperture Integrated Circuit Imaging
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for content titled, Image Reconstruction Techniques for High Numerical Aperture Integrated Circuit Imaging
As feature sizes in integrated circuits (ICs) become smaller, higher-resolution defect detection and failure analysis techniques are required. The introduction of solid immersion lenses (SIL) has been an enabling technology for highresolution backside IC imaging. High Numerical Aperture (NA) SIL imaging introduces properties of focused light which cannot be predicted by scalar beam optics. For example, spatial resolution can be manipulated in selected directions by modification of the polarization direction in linearly polarized light. In this work, we propose a unified framework combining multiple SIL microscopy images collected using polarizations at different directions in order to improve image reconstruction performance and ultimately resolution and defect localization. We show improvement in reconstruction quality by combining data taken using light with multiple polarizations. We demonstrate the effectiveness of our framework on experimental data.