We demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used in conjunction with a new one-dimensional lump circuit simulation software to quickly and non-destructively isolate faults in advanced IC packages. In the case studies presented, short failures are accurately located in a series of advanced IC package.

Here, we demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used to quickly and non-destructively isolate faults in 2.5D packages. We present case studies to show how EOTPR can unambiguously differentiate between faults located in the C4 bump, TSV, RDL, and micro-bump of a 2.5D package.

We combine Electro Optical Terahertz Pulse Reflectometry (EOTPR), with full three dimensional device-under-test (DUT) modeling utilizing virtual known good device to quickly and non-destructively isolate faults in advanced 3D IC packages. Computation power required for modeling can quickly become prohibitive with the design complexities of modern IC packages. In this study we adopt a piecemeal modeling approach that bypasses this exponential requirement. A PFA study verifies the accuracy of our model. This shows that feature-based fault analysis with a distance-to-defect accuracy of less than 10 μm can be readily attained through the combination of these techniques.

Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR) [1], with full 3D device-under-test (DUT) modelling to quickly and nondestructively perform feature-based analysis. We demonstrate fault isolation to an accuracy of 10 ìm or better with respect to device features in an advanced integrated circuit (IC) package.

Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.

The creep enhanced low alloy steel with 2.25Cr-1.6W-V-Nb (HCM2S; Gr.23, ASME CC2199) has been originally developed by Mitsubishi Heavy Industries, Ltd. and Sumitomo Metal Industries, Ltd. The steel tubes and pipe (T23/P23) are now widely used for fossil fired power plants all over the world. Recently, the chemical composition requirements for ASME Code of the steel have been changed and a new Code Case 2199-4 has been issued with the additional restriction regarding Ti, B, N and Ni, and the Ti/N ratio incorporated. In this study, the effects of additional elements of Ti, N and B on the mechanical properties and microstructure of T23/P23 steels have been evaluated. It is found that N decreases the hardenability of the steel by forming BN type nitride and thus consuming the effective B, which is a key element for hardening of the steel. The addition of Ti, on the other hand, enhances the hardenability of the steel by precipitating TiN and thus increasing the effective B. It is also found that too much addition of Ti degrades the Charpy impact property and creep ductility of the steel to a great extent. This phenomenon might affect the steel's long-term creep rupture properties, although a steel with the original chemical composition has demonstrated high creep strength at temperatures up to 600°C for more than 110,000 h.

The growth behavior of oxide scale in a laboratory steam environment has been conducted for the shot-peened 18Cr-8Ni stainless steels differing in grain size. Both steels (fine grained and coarse grained) have demonstrated almost the same steam oxidation behavior reacted at 700°C for up to 2000h, which had excellent oxidation resistance due to formation of a protective Cr 2 O 3 scale. After the exposure of 4000h, however, nodule-like oxide occurred on the coarse grained steel, while the fine grained steel still remained the uniform Cr 2 O 3 scale. These behaviors well explained in terms of changes of the outward Cr flux due to recovery and recrystallization of the deformed structure. This result has proven that the shot-peened tube composed of fine grain structure is capable of combat against the steam oxidation at high temperatures.

A study of Grade 91 steel's creep rupture behavior at 600°C (up to 90,000 hours) and 650°C (up to 23,000 hours) reveals that static recovery of tempered martensite lath structures leads to decreased stress exponent and breakdown of creep strength. While M 23 C 6 and MX particles initially stabilize lath structures by hindering sub-boundary migration, the progressive aggregation of M 23 C 6 particles reduces their pinning force, triggering static recovery. Although Grade 91 steel shows better M 23 C 6 thermal stability compared to Grade 122 type steels (9-12%Cr-2W-0.4Mo-1Cu-VNb), coarsening of M 23 C 6 particles and subgrain width is expected to occur slightly beyond 100,000 hours at 600°C, potentially leading to creep strength breakdown.

Creep deformation behavior of the T122 type steels with different matrix phases such as α’ (martensite) and α’+δ (martensite and delta-ferrite) at different stress levels has been studied comparing with those of the model steels with the initial microstructures consisting of the various combination of matrices such as ferrite (α), martensite (α’) and austenite (γ), and precipitates such as MX and M 23 C 6 . The heterogeneous creep deformation is found to be pronounced at lower stress level in the steel with a dual phase matrix of α’+δ, resulting in a complex sigmoidal nature in the creep rupture life. The creep deformation process of the steel with the dual phase matrix is similar to that of the model steel with the α phase matrix which exhibits a typical heterogeneous creep deformation and the early transition to the acceleration creep at a very small creep strain. Such a heterogeneous creep deformation is much pronounced along the interfaces between the soft δ ferrite and the hard martensite (α’) phases, and has a viscous nature in creep deformation which was first identified in P91 steel. It is concluded that the homogeneous microstructure is a key for achieving the long-term creep strength in the advanced ferritic steels at elevated temperatures over 600°C.