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M. Hao
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Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 496-501, November 9–13, 2014,
Abstract
View Papertitled, Al-Cu Alloy Films Characterization and Studies Using TOF-SIMS, XPS, AFM, EBSD and TEM
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for content titled, Al-Cu Alloy Films Characterization and Studies Using TOF-SIMS, XPS, AFM, EBSD and TEM
Aluminum-copper alloys are popular for many applications that take advantage of the combination of properties in the alloys. This paper describes the use of multiple advanced failure analysis tools to analyze the physical and chemical properties of Al-Cu alloy thin films.
