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Lewis Stern
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Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 455-462, November 11–15, 2012,
Abstract
View Papertitled, Fabrication and Characterization of Helium and Neon Ion Deposited Platinum Wires for Circuit Edit Applications
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for content titled, Fabrication and Characterization of Helium and Neon Ion Deposited Platinum Wires for Circuit Edit Applications
Sub-nanometer focused inert gas ions derived from a Gas Field Ion Source (GFIS) contain properties that can improve the dimensional and conductivity characteristics of ion beam deposited platinum circuit edit wiring. The following paper, presents ion interaction simulations that help provide insight into the factors which determine the ultimate wire width, resistivity, and metal deposition rates. An experimental result that has aided in the understanding of the primary wire width limiting mechanism is also presented. Finally, a description of the ion beam and precursor properties used for the platinum deposition is provided, a long with a discussion of the wire resistivity measurement technique and challenges. To conclude, the prospects for GFIS ion induced dielectric and metal deposition for circuit edit and nanofabrication applications are discussed.
Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 339-345, November 15–19, 2009,
Abstract
View Papertitled, The Helium Ion Microscope for High Resolution Imaging, Materials Analysis, Circuit Edit and FA Applications
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for content titled, The Helium Ion Microscope for High Resolution Imaging, Materials Analysis, Circuit Edit and FA Applications
Currently, the helium ion microscope (HIM) can be operated in three imaging modes; ion induced secondary electron (SE) mode, Rutherford backscatter imaging (RBI) mode, and scanning transmission ion imaging (STIM) mode. This paper will provide an overview of microscope’s ion source, its ion optics, the system architecture, the fundamentals of these three imaging modes and many FA related examples. Recently integrated with the microscope are a Rutherford Backscatter (RBS) detector for materials analysis and a gas injection system (GIS) for material modification. We will describe this new hardware and suggest how these additions could also contribute to the helium ion microscope being an important failure analysis tool.