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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 78-84, November 12–16, 2023,
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Analog Devices Inc. (ADI)’s Radar Receive Path Analog Front End Amplifier (AFE) with a 0.18um 6-metal Fab Process has failures related to Power-Down and Scan test parameters which were endorsed for Failure Analysis. Fault localization is quite challenging because it involves 6 metal layers. This has been resolved with the availability of Synopsis Avalon software with capability to convert the complete Cadence schematics and layout that is usable for Failure Analysis, through cross-mapping with the fault localized area-of-interest (AOI) on the actual reject part with the die schematics and layout, and identifying the failing component and circuit block. This leads to the creation of the failure model related to the reported failure mode and the determination of the appropriate failure mechanism related to fabrication defects between the adjacent metallization layers and defects on between the polysilicon and substrate layer. This helps speed up the FA Cycle Time and achieve an accurate failure mechanism, which later resolves the fab defect issue with the Fab process owner.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 86-91, October 30–November 3, 2022,
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The instrumentation amplifier products are high-volume runner products hence, also a high volume of returns are encountered at Failure Analysis Department. To solve each return would need a highly structured technique that requires extensive plot of results for the determination of proper failure mechanism. A perceptive approach that the Failure Analyst deal with in solving the different issues encountered is the compilation of failure data using commonality study of returns with summary that can easily be seen on a Measles chart. A compilation of complete list of historical analysis with circuit block layout designation, test methods, signature cases, microprobing and circuit analysis collaboration results are consolidated in one file to help guide the Analyst in determining the exact cause of failure, thus improving quality and turnaround time that translates to cycle time improvement of 56% CT days reduction hence creating value to the customer.