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Ken Sias
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Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 143-147, November 9–13, 2014,
Abstract
View Papertitled, The Physical Isolation of a Die in a Stacked-Die Configuration
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for content titled, The Physical Isolation of a Die in a Stacked-Die Configuration
This paper will illustrate the procedures to physically isolate one die in a stacked-die configuration. This highly reliable, systematic method allows for failure analysis engineers of all levels to successfully isolate the die of interest for further investigation.
