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Josef Maynollo
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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 243-245, November 12–16, 2023,
Abstract
View Papertitled, Fractographic Case Studies of Thinning Related Fracture-Patterns in Silicon Chips
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for content titled, Fractographic Case Studies of Thinning Related Fracture-Patterns in Silicon Chips
The development of modern power semiconductors requires the reduction of the resistance in the on-state of the device. One way to accomplish this is to reduce the bulk silicon thickness. To reach low final Si thicknesses, the grinding processes have to be adapted and optimized and new process-flows, such as dicing before grinding (DBG), must be employed.
