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1-2 of 2
John Michael Saputil
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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 534-537, November 12–16, 2023,
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In failure analysis, demounting and mounting is one of the steps in preparation for the electrical verification of the device. Performing decapsulation while the unit is mounted on the printed circuit board (PCB) is one of the solutions to limit the repeated demounting, mounting, and re-balling processes. However, it can cause inadvertent damage to the device and the PCB when the acids overflow, which could hinder further electrical verification of the unit. In this study, a new method of decapsulation using aluminum tape is used to protect the device and PCB during the decapsulation process. Results show that the use of aluminum tape is an effective method for decapsulating packaged units on PCB. It can prevent damages such as external lead detachment after demounting, ball pad oxidation, and recovery of device failure due to heat application.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 398-401, October 30–November 3, 2022,
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As the electronics industry moves towards miniaturization, the semiconductor industry provided packaging innovations to meet the demands for smaller footprints. One of the packaging solutions is the small outline transistor (SOT) which is widely used in various applications including automotive engine downsizing. Decapsulation of small packaged devices like a 1.3mm by 2.9mm SOT is one of the greatest challenges in failure analysis. The destructive nature of decapsulation may cause inadvertent and permanent damage, hindering further electrical verification on the unit. In this paper, a novel method for decapsulating SOT devices is presented utilizing the use of acrylic molding to avoid damage on the units during decapsulation process. Results show that the use of acrylic molding is an effective method in decapsulating SOT packaged devices maintaining die functionality, hence, addressing the decapsulation issues and risks caused by other existing decapsulation methods.