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John Bescup
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Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 163-169, October 30–November 3, 2022,
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While 2.5D and 3D solutions continue to drive advancements in the electronics packaging industry, challenges persist with their reliability and qualification. In this paper, we introduce a new technique that may prove valuable for nondestructive, in-situ measurements of package and die warpage. This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C).
Proceedings Papers
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 49-52, October 31–November 4, 2021,
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This paper describes a project to develop and deploy a systematic screening methodology involving computed tomography (CT) to inspect a set of electromagnetic interference (EMI) filter components for a spacecraft application. The goal was to deploy the nondestructive CT test to replace the destructive test method typically deployed for such components. The paper describes the development of test criteria, fixturing, inspection process, and data analysis, including quantitative image analysis of voids and cracks. The initial results indicated that the parts would not pass the requirements established in the test design. A waiver was written to the project clarifying that if the parts were to be used in the assembly, they should be considered as simple conductors with EMI filtering capability viewed as an added benefit rather than a guaranteed design requirement.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2016) 18 (3): 4–8.
Published: 01 August 2016
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This article explains how the failure of a high-voltage capacitor led to the discovery of an unusual defect. Testing showed that the capacitor shorted due to silver migration, which investigators believe was facilitated by voids in the dielectric that had been present from the time of manufacture. Through some combination of time, electric potential, trapped humidity, and elevated operating temperature, plate material migrated into the voids, creating a short path that led to the failure. Using acoustic images as a guide, the failed capacitor was cross-sectioned, allowing investigators to examine the voids more closely and thereby confirm their theory.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2015) 17 (3): 30–34.
Published: 01 August 2015
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This article presents a case study of an IC failure that occurred in a downhole drilling environment. It describes the tests and examinations that were performed and explains how investigators determined that the Kirkendall effect contributed to the failure.