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Jason Mulig
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Proceedings Papers
ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 19-25, November 14–18, 1999,
Abstract
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A new tool (Schlumberger IDS 2000) has become available for acquiring waveforms from C4 (also known as flip chip) packaged IC’s. The waveform acquisition technique is based on electro-optic sampling through the backside of silicon. After explaining the physics of electro-optic sampling, the technique is demonstrated through the backside of Si on a simple diode test structure and a flip chip microprocessor. Also, many of the issues and challenges with this tool are discussed.
