We demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used in conjunction with a new one-dimensional lump circuit simulation software to quickly and non-destructively isolate faults in advanced IC packages. In the case studies presented, short failures are accurately located in a series of advanced IC package.

Here, we demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used to quickly and non-destructively isolate faults in 2.5D packages. We present case studies to show how EOTPR can unambiguously differentiate between faults located in the C4 bump, TSV, RDL, and micro-bump of a 2.5D package.

We combine Electro Optical Terahertz Pulse Reflectometry (EOTPR), with full three dimensional device-under-test (DUT) modeling utilizing virtual known good device to quickly and non-destructively isolate faults in advanced 3D IC packages. Computation power required for modeling can quickly become prohibitive with the design complexities of modern IC packages. In this study we adopt a piecemeal modeling approach that bypasses this exponential requirement. A PFA study verifies the accuracy of our model. This shows that feature-based fault analysis with a distance-to-defect accuracy of less than 10 μm can be readily attained through the combination of these techniques.

Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR) [1], with full 3D device-under-test (DUT) modelling to quickly and nondestructively perform feature-based analysis. We demonstrate fault isolation to an accuracy of 10 ìm or better with respect to device features in an advanced integrated circuit (IC) package.

Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.