The incore instrumentation system of a pressurized water reactor (PWR) facilitates neutron flux mapping and temperature measurements at specific core locations. A guide conduit, extending from the seal table to the lower reactor pressure vessel head, guides and protects each incore guide thimble between the table and the lower reactor vessel head. Each flux thimble houses a detector and drive cable. Once filled with reactor coolant, the conduit becomes an extension of the reactor coolant pressure boundary. This paper reports the examination results of cracking detected in a TP304 stainless steel guide conduit adjacent to a fillet weld at the upper surface of a TP304 seal table. The cracking resulted in reactor coolant leakage that was detected by the presence of boric acid deposits on the exterior of the conduit and table. Failure analysis including dimensional measurements, chemical analysis, stereomicroscopy, metallography, and scanning electron microscopy showed that extensive cracking of the conduit and seal table material occurred due to stress corrosion cracking (SCC). Assessment showed that chlorine-containing deposits were present on the exterior of the conduit and on the surfaces of the seal table and were due to the design and operation of HVAC systems at the coastal plant. Stainless steels are susceptible to SCC in environments with elevated temperatures, chloride contents, and increased tensile stress – particularly in non-post weld heat treated (PWHT) weld regions and the heat affected zone (HAZ). This was the apparent primary cause of the failure. However, chloride-induced SCC of such materials typically results in transgranular crack propagation, whereas the observed cracks were indicative of intergranular stress corrosion cracking (IGSCC). Microstructural analysis showed that the observed cracks initiated in sensitized areas of material adjacent to the weld. Sensitization of the material caused chromium depletion from adjacent areas and increased susceptibility of the depleted areas to IGSCC. In this case, the most probable source of sensitization was related to welding and the long-term growth of grain boundary carbides nucleated during welding. This was considered a contributing cause to the failure.

Backside FIB circuit edit is an effective way to modify circuit on flip chip or stacked chips. Directly damaging memory cell through bulk silicon by FIB can be used to locate bit address to verify that the scramble test program coordinates correspond to the physical cell location. This paper presents the application of FIB for chip editing, discusses the limitation of the FIB approach and reports the scramble test experiments about the front-side and backside FIB technique to correct scramble testing data.