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H. Hidalgo
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Proceedings Papers
Alumina Duplex Coating by Multiprocesses: Air Plasma Spraying and Plasma Enhanced Chemical Vapor Deposition
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ITSC 2001, Thermal Spray 2001: Proceedings from the International Thermal Spray Conference, 613-619, May 28–30, 2001,
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View Papertitled, Alumina Duplex Coating by Multiprocesses: Air Plasma Spraying and Plasma Enhanced Chemical Vapor Deposition
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for content titled, Alumina Duplex Coating by Multiprocesses: Air Plasma Spraying and Plasma Enhanced Chemical Vapor Deposition
Thick alumina coatings produced by Air Plasma Spraying have an interconnected porosity, thus the use of these coatings in oxidizing or corrosive environment is not suitable. In this paper, a study is developed in order to limit this problem on metallic substrates. It consists in using two successive techniques: APS and PECVD. Two parameters have been shown to be important: the roughness and the preheating temperature. Two types of duplex (PECVD coating as top coat or as bond coat) have been achieved on two substrates (TA6V and stainless steel 316L). The optimization of each process has shown that the substrate has to be grit blasted and preheated (360°C for PECVD and 250°C for APS). This study has revealed that a good (36 ± 5 MPa) APS coating adhesion was obtained on smooth TA6V substrates (due probably to a chemical reaction between TiO 2 and alumina) while for stainless steel substrates, the Ra has to be at least 2µm to achieve 66 ± 5. When observing the first APS splats sprayed on the PECVD alumina smooth layer, they exhibited a specific appearance: low flattening degree (about 2 against 5 on metallic substrates) with most of the alumina in the splat rim or some sort of lace morphology. However, as a whole, the adhesion of the APS coating on the PECVD one was excellent: 60 + 4. An electrochemical method has shown that the PECVD layer on APS coating has reduced drastically its open porosity.