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Gina Cha
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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 295-299, November 12–16, 2023,
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In this paper, we discuss and showcase a 2-step defect isolation methodology by combining Focused Ion Beam “circuit editing” (FIB circuit edit) and Passive Voltage Contrast (PVC) imaging. The combo technique is an effective, robust, and time saving method for isolating defects in large area circuit structures for advanced nodes. The application of FIB circuit edits successfully enhanced the PVC efficiency in defect isolation. More importantly, the developed 2-step methodology improves failure analysis (FA) success rate and quality, and reduces FA turn-aroundtime (TAT).
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 92-96, October 30–November 3, 2022,
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This paper reports the novel application of Plasma Focused Ion Beam (pFIB) to reveal subtle defects in advanced technology nodes. Two case studies presented, both of which alter the standard work procedure in order to find the defects. The first case highlights the precise milling capability of pFIB in discovering the metal buried via void that is easy-to-miss by standard failure analysis (FA) practice. The second utilizes pFIB circuit edit process to facilitate electrical isolation in pinpointing the exact failure location and thus enables identifying the defect more efficiently.