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Gerhard Schneider
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Journal Articles

Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning

Kishansinh Rathod, Sankeerth Desapogu, Andreas Jansche, Timo Bernthaler, Gerhard Schneider ...
Journal: EDFA Technical Articles
EDFA Technical Articles (2024) 26 (3): 4–11.
DOI: https://doi.org/10.31399/asm.edfa.2024-3.p004
Published: 01 August 2024
Abstract
A deep learning-based nondestructive approach for void segmentation in BGA solder balls using 3D x-ray microscopy is presented.
View articletitled, Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning View PDF for article titled, Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning