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François Kerisit
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Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 87-93, November 9–13, 2014,
Abstract
View Papertitled, Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices
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for content titled, Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices
The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.
