Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Subjects
Article Type
Volume Subject Area
Date
Availability
1-1 of 1
Eric Wong Soon Kiong
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 382-385, October 30–November 3, 2022,
Abstract
View Paper
PDF
Viewing the cross section of wafers with glass carriers has always been a challenging task. Add on to observing and determining the glue coverage is an uphill struggle due to the fragile nature of the glue. The traditional technique of cleaving wafers equipped with glass carriers is neither promising nor highly successful. In addition to the mentioned disadvantages, the presence of glass carrier would mean cleaving the wafer with a diamond scriber, a dangerous technique due to the possibility of fragmentation of the glass carrier which could be a potential safety hazard. Time consuming, low success rate, lack of finesse and potential safety hazard of the conventional cleaving method had paved the path of an alternative technique to assess glue coverage for wafers equipped with glass carriers. This manuscript would give an elaborate insight of a novel technique employed in analysing the glue coverage of wafers with glass carriers.