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Edward Principe
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Proceedings Papers
ISTFA2023, ISTFA 2023: Tutorial Presentations from the 49th International Symposium for Testing and Failure Analysis, q1-q77, November 12–16, 2023,
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Presentation slides for the ISTFA 2023 Tutorial session “Charged Particle Systems-Fundamentals and Opportunities.”
Proceedings Papers
ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, n1-n76, October 30–November 3, 2022,
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This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.
Proceedings Papers
ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, n1-n72, October 31–November 4, 2021,
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This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2016) 18 (4): 30–40.
Published: 01 November 2016
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The complexity of sample preparation and deprocessing has risen exponentially with the emergence of 2.5-D and 3D packages. This article provides answers and insights on how to deal with the challenges of increasingly complex semiconductor packages. After identifying pressing issues and potential bottlenecks with state-of-the-art FA flows, the authors present two case studies demonstrating the capabilities of electro-optical terahertz pulse reflectometry (EOTPR), plasma FIB milling, and 3D X-ray imaging. The FA results confirm the potential of all three techniques and indicate that a fully nondestructive integration flow for 3D packages may be achievable with further development and optimization.
Proceedings Papers
ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 429-435, November 14–18, 2004,
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Increased insight into the internal structure of microelectronic devices can be achieved through the use of three dimensional (3D) imaging based on image stacks of serial sections obtained with a combined electron and ion beam (CrossBeam) FIB. This study describes how such data can be collected and presented, some of the factors that need to be optimized to get the best images, and the limitations of the method. It can be viewed as a first step in the emerging area of high resolution 3D microscopy, a technique that can lead to more accurate characterization of the shapes of internal structures and their interconnectivity at the nanoscale.