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Journal Articles

Delineate Lightly Doped CMOS N-Well With Wet Etch

Doug Hamilton, Phoumra Tan
Journal: EDFA Technical Articles
EDFA Technical Articles (2015) 17 (2): 32–33.
DOI: https://doi.org/10.31399/asm.edfa.2015-2.p032
Published: 01 May 2015
Abstract
Lightly doped source-drain diffusions are difficult if not impossible to delineate using wet chemical etching, but with a few process modifications and the use of edge shorting, a 20:1 HNO 3 /HF etch for 5 s at room temperature can reveal almost any junction profile in a CMOS device. The relatively simple process is outlined in this installment of Master FA Technique, which also includes a series of images showing how well the method works.
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Journal Articles

Unique FIB Application for Mechanical Cross Sectioning

Doug Hamilton, Phoumra Tan
Journal: EDFA Technical Articles
EDFA Technical Articles (2014) 16 (4): 44–45.
DOI: https://doi.org/10.31399/asm.edfa.2014-4.p044
Published: 01 November 2014
Abstract
This failure analysis case study illustrates the masterful use of a dual-beam FIB to reveal hidden details in a mechanically polished cross-section.
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Proceedings Papers

Applying Innovative Techniques for Solving FA Challenges of 3D IC Failures Utilizing Conventional Equipment

Phoumra Tan, Kenny Ng, Eric Thorne, S.Y. Pai, Doug Hamilton ...
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 49-54, November 9–13, 2014,
https://doi.org/10.31399/asm.cp.istfa2014p0049
Abstract
With the advent of three-dimensional stacked integrated-circuit (3D IC), the functionality, performance and power of semiconductor devices has been elevated to a new level. At the same time, the analytical techniques used in the evaluation of 3D IC must also advance in capability. Some new methodologies, based on FPGA products, have been developed to analyze 3D IC failures, all using conventional FA equipment and innovative techniques to achieve a short turn-around time and high success rate. A few case studies will be presented to show the effectiveness of the methodologies.
View Papertitled, Applying Innovative Techniques for Solving FA Challenges of 3D IC Failures Utilizing Conventional Equipment View PDF for content titled, Applying Innovative Techniques for Solving FA Challenges of 3D IC Failures Utilizing Conventional Equipment