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Cheryl Hartfield
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Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2024) 26 (4): 14–19.
Published: 01 November 2024
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This article shows how 3D XRM can be applied to nondestructively detect non-optimized assembly processes that can influence local stresses and overall device reliability. This makes it useful for process development and failure analysis. When used along with AI training models, 3D XRM can achieve analysis of highly integrated packaging structures with reasonable throughput for process validation and error correction guidance.
Proceedings Papers
ISTFA2024, ISTFA 2024: Tutorial Presentations from the 50th International Symposium for Testing and Failure Analysis, t1-t56, October 28–November 1, 2024,
Abstract
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Presentation slides for the ISTFA 2024 Tutorial session “Fundamentals and Emerging Capabilities: 3D X-Ray Imaging for Semiconductor Advanced Package Failure Analysis.”
Proceedings Papers
ISTFA2024, ISTFA 2024: Tutorial Presentations from the 50th International Symposium for Testing and Failure Analysis, z1-z46, October 28–November 1, 2024,
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Presentation slides for the ISTFA 2024 Tutorial session “Fundamental Considerations in the Justification, Design and Construction of an Analytical Laboratory for High Tech Imaging and Processing Tools (2024 Update).”
Proceedings Papers
ISTFA2024, ISTFA 2024: Conference Proceedings from the 50th International Symposium for Testing and Failure Analysis, 478-484, October 28–November 1, 2024,
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The effects of sample prep with a Ga + -ion Focused Ion Beam (Ga-FIB) on measurements of electron beam induced current (EBIC) were studied. Concerns have been occasionally raised about amorphization from the beam, or even Ga + implantation ruining the ability to make useful measurements for purposes of either failure analysis or device tailoring. To understand the magnitude of any deleterious effects, two different lamellae from a 5 nm SRAM sample were prepared with different areas of increasingly improved polish, as indicated by decreasing, cumulative, FIB beam energy, followed by EBIC measurements at 1 or 2 kV beam landing energy. A first experiment looked at the ability to generate EBIC measurements from depletion zones and found no difference across the various beam polish cells. A second experiment considered leakage and/or shorts and found little problematic currents, within standard deviations.
Proceedings Papers
ISTFA2023, ISTFA 2023: Tutorial Presentations from the 49th International Symposium for Testing and Failure Analysis, s1-s43, November 12–16, 2023,
Abstract
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Presentation slides for the ISTFA 2023 Tutorial session “Fundamental Considerations in the Justification, Design, and Construction of an Analytical Laboratory for High Tech Imaging and Processing Tools.”
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2023) 25 (1): 20–27.
Published: 01 February 2023
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This is the story of how the mainstream Omniprobe FIB lift-out solution was invented and delivered to the market.
Proceedings Papers
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 240-250, October 30–November 3, 2022,
Abstract
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The design and construction of a well-executed laboratory space to house high resolution analytical imaging and processing tools can often be more complex and expensive than anticipated. Unlike their manufacturing counterparts, lab tools as a class have fewer built-in countermeasures to fend off operational degradation caused by external factors. A poorly optimized facility can result in significant underperformance of installed systems, thereby wasting the investment and jeopardizing the mission. Unfortunately, very few assigned laboratory spaces are ‘naturally’ perfect for the installation of new analytical equipment at the outset. It typically takes considerable work to engineer most locations so that the tools function as they should and live up to expectations. The magnitude of the challenge and its true cost and lead time often come as a huge surprise to failure analysis engineers tasked with wearing multiple ‘hats’ while navigating the capital approval process. Being caught off guard in this manner often results in considerable time delay, as well as over-budget or sub-par outcomes. In this paper we offer suggestions on how to revamp the typical capital cycle process for specifying, buying, and installing future laboratory tools. We furthermore aim to produce an abbreviated reference guide for tool owners on facility requirements needed to ensure optimal analytical system performance.
Proceedings Papers
ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, q1-q52, October 30–November 3, 2022,
Abstract
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This presentation covers the challenges associated with IC package inspection and shows how two nondestructive techniques, scanning acoustic microscopy and X-ray imaging, are being used to locate and identify a wide range of defects, particularly those in 3D packages and multilayer boards. It reviews the basic principles of scanning acoustic microscopy (SAM), X-ray imaging, and 3D X-ray tomography and the factors that affect image resolution and depth. It demonstrates the current capabilities of each method along with different approaches for improving resolution, contrast, and measurement time.
Proceedings Papers
ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 424-428, October 28–November 1, 2018,
Abstract
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An effective method is presented to locate certain failure sites on exposed junction of insulated-gate bipolar transistor (IGBT) devices. High emitter to collector leakage current, hereafter called ICESR, is an IGBT failure mode. The leakage current is typically related to the exposed P+/N+ junction on the die sidewall. Solder die attach residue bridging or silicon damage at this exposed P+/N+ junction are common causes of ICESR leakage. The die attach residue can be dislodged during decapsulation resulting in loss of failure information. A failure analysis flow will be described to precisely locate the ICESR leakage site without disturbing any possible die attach residue.
Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 399-405, November 11–15, 2012,
Abstract
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Two-beam systems (focused ion beam (FIB) integrated with a scanning electron microscope (SEM)) have enabled site-specific analysis at the nano-scale through in situ “mill and view” capability at high resolution. In addition, a FIB-SEM can be used to cut away a lamella from a bulk sample and thin it for transmission electron microscopy (TEM) imaging. We studied the temperature dependence of FIB milling on compound semiconductors and thin films such as copper that are used in integrated circuits. These materials (GaAs, GaN, InN, etc) react chemically and physically with the gallium in the FIB and change chemical composition and may also change morphology. Copper metallization of IC’s has been difficult to mill without undesirable side effects. FIB milling for analysis of these materials becomes difficult if not impossible. Since temperature can be a big factor in chemical and physical reactions we investigated this and report here the effect of cooling the sample to cryogenic temperatures while milling. In addition, we report on the development of a process to prepare TEM lamellae with FIB entirely in a cryogenic environment.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2011) 13 (3): 18–26.
Published: 01 August 2011
Abstract
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This article discusses the practice of FIB-based in situ lift-out, a sample preparation method that has proven particularly useful for failure analysis. It explains how samples are now being made for a wide range of TEM techniques, including holography, tomography, high-angle annular dark-field scanning, and electron energy-loss spectroscopy. In most cases, achieving optimal quality requires the use of alternate FIB milling angles, as in plan-view, sideways, and backside milling, all of which are discussed.
Proceedings Papers
ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 262-269, November 4–8, 2007,
Abstract
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In many cases it is difficult to distinguish mechanical damage from electrostatic surface impacts. In recent years, several investigations have resulted in publications on ESDFOS (Electrostatic Discharge From Outside to Surface). While the diagnostics of the phenomena have been worked out quite well for wafers with aluminum metallization, no formal studies on ESDFOS impact to copper-metallized wafers have been published. This paper investigates physical features of Cu-metallized wafers artificially exposed to ESDFOS impacts of variable severity, producing an understanding of damage features to more easily facilitate recognition of EDSFOS events.
Proceedings Papers
ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 267-276, November 14–18, 2004,
Abstract
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The continuing evolution of semiconductor packages to finer solder ball pitches, shrinking solder ball volume, and new solder materials, mandates the availability of methods to accurately assess solder joint reliability both at the component and at the board level. Many tests in use for this purpose cannot provide direct measurements of solder joint interfacial strength. This paper reports on the investigation of laser spallation for interfacial strength assessments and understanding of failure mechanisms on chip scale package (CSP) solder joints.