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Céline Le Gloanec
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Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 214-219, November 12–16, 2023,
Abstract
View Papertitled, ICCDLAB : Silicon Chip Tooling for Failure Analysis Laboratories
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for content titled, ICCDLAB : Silicon Chip Tooling for Failure Analysis Laboratories
The ICCDLAB (Integrated Circuit for Characterization and Debug Laboratory) test chip is a full custom silicon chip dedicated to failure analysis. This chip embeds several custom devices designed to highlight, reproduce, and simulate defects, as well as enhance the signatures obtained through failure analysis techniques that are used to locate defects in circuits. The ICCDLAB serves as a versatile tool for failure analysts, providing a “Swiss army knife” and a failure analysts’ playground at the same time. The chip offers a simple means of covering an exhaustive catalog of failure analysis techniques and approaches, allowing for equipment benchmarking, training of individuals new to the failure analysis field, understanding of failure mechanisms and signatures, simulation of defect behaviors, and support for development of new techniques.