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1-9 of 9
Bhanu Sood
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
Abstract
Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters to create counterfeits. These include relabeling, refurbishing, and repackaging. The article presents a systematic inspection methodology that can be applied for detecting signs of possible part modifications. The methodology consists of external visual inspection, marking permanency tests, and X-ray inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit parts.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2014) 16 (2): 4–16.
Published: 01 May 2014
Abstract
View articletitled, Health Monitoring of Lithium-Ion Batteries
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for article titled, Health Monitoring of Lithium-Ion Batteries
This article presents a new technique for monitoring the health of lithium-ion cells. Whereas traditional methods use current, voltage, and temperature data to infer the overall health of the cell, the new method uses ultrasonic measurements to assess structural changes such as swelling, expansion, ruffling, and delamination. The article explains how and why these changes occur, how they are measured, and how they correlate with loss of battery capacity, safety, and failure. It also discusses the effect of charge and discharge cycles and the factors that contribute to gas generation.
Proceedings Papers
ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 239-249, November 11–15, 2012,
Abstract
View Papertitled, Lithium-ion Battery Degradation Mechanisms and Failure Analysis Methodology
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for content titled, Lithium-ion Battery Degradation Mechanisms and Failure Analysis Methodology
A review of the prevalent degradation mechanisms in Lithium ion batteries is presented. Degradation and eventual failure in lithium-ion batteries can occur for a variety of dfferent reasons. Degradation in storage occurs primarily due to the self-discharge mechanisms, and is accelerated during storage at elevated temperatures. The degradation and failure during use conditions is generally accelerated due to the transient power requirements, the high frequency of charge/discharge cycles and differences between the state-of-charge and the depth of discharge influence the degradation and failure process. A step-by-step methodology for conducting a failure analysis of Lithion batteries is presented. The failure analysis methodology is illustrated using a decision-tree approach, which enables the user to evaluate and select the most appropriate techniques based on the observed battery characteristics. The techniques start with non-destructive and non-intrusive steps and shift to those that are more destructive and analytical in nature as information about the battery state is gained through a set of measurements and experimental techniques.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2012) 14 (2): 28–29.
Published: 01 May 2012
Abstract
View articletitled, G-19 Update: Management of Testing and Inspection Data Generated from Counterfeit Parts Inspection
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for article titled, G-19 Update: Management of Testing and Inspection Data Generated from Counterfeit Parts Inspection
Counterfeit electronic parts have become a significant cause of concern in the electronics part supply chain. Several factors that contribute to the targeting of the electrical, electronic, and electromechanical (EEE) parts market by counterfeiters include parts obsolescence, extended lead times, the absence of verification tools, the availability of scrapped or salvaged parts, and the high costs associated with inspection/testing procedures. This article reports on the status of efforts by the G-19 Committee of SAE International to develop standards in response to increasing numbers of counterfeit parts in the supply chain.
Proceedings Papers
ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 446-452, November 13–17, 2011,
Abstract
View Papertitled, The “Perfect Storm” Now Appearing in FA Labs Everywhere
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for content titled, The “Perfect Storm” Now Appearing in FA Labs Everywhere
The International Symposium for Testing and Failure Analysis (ISTFA) 2010 event added a focus topic on Counterfeiting in Electronics. This topic was chosen because of the emergence of this concern and the critical role that Failure Analysis plays in this challenge. Failure Analysts will be involved deeply as companies worldwide are attempting to reduce the impact of increasing numbers of counterfeit products in the supply line and in fielded products. This paper will attempt to provide an overview of the topic and support the contributors to ISTFA 2010 while providing additional resources for information.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2011) 13 (2): 47–48.
Published: 01 May 2011
Abstract
View articletitled, G-19A Test Laboratory Standards
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for article titled, G-19A Test Laboratory Standards
This column reports on efforts by the SAE G-19A committee to develop an aerospace industry standard on practices to detect suspect counterfeit components, maximize the use of authentic parts, and ensure consistency across the supply chain for test techniques and requirements.
Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 293-300, November 15–19, 2009,
Abstract
View Papertitled, Degradation Analysis of Thick Film Chip Resistors
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for content titled, Degradation Analysis of Thick Film Chip Resistors
Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.
Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 301-308, November 15–19, 2009,
Abstract
View Papertitled, Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants
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for content titled, Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants
Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.
Proceedings Papers
ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 59-64, November 2–6, 2008,
Abstract
View Papertitled, Thick Film Resistor Failures
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for content titled, Thick Film Resistor Failures
Thick film resistors are widely used in consumer and industrial products such as timers, motor controls and a broad range of high performance electronic equipment. This article provides information on failures due to copper dendrite growth, silver migration, sulfur atmosphere corrosion, variation of temperature, and crack due to molding compound mechanisms. It presents case studies in which a physical analysis plan was developed and executed to investigate these sites of interest on as-manufactured and failed thick film power resistors. The analysis techniques included X-ray inspection, cross-sectioning, decapsulation, and optical and environmental scanning electron microscopy analysis. A table illustrates different failure modes and mechanisms for thick film resistors, and also potential application and manufacturing factors that cause failure mechanisms, which then describe the failure modes. The article is concluded that by preventing the failure of thick film resistors, printed circuit boards can be kept in service for their full lifetime.