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Bhanu P. Sood
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Proceedings Papers
ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 152-153, November 1–5, 2015,
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The Society of Aerospace Engineers (SAE) AS6171 Aerospace Standard standardizes the test and inspection procedures, workmanship criteria, and minimum training and certification requirements to detect counterfeit electrical, electronic, and electromechanical parts. The standard comes in response to a significant and increasing volume of counterfeit electrical, electronic, and electromechanical parts entering the supply chain. This short manuscript and its accompanying talk update the audience on the risk based methodology for detecting potential counterfeiting related defects. The techniques that are discussed in AS6171 slash sheet include film radiography and filmless radiography such as digital radiography, real time radiography, and computed tomography. The analysis is performed on parts to verify that the internal package or die construction is consistent with an exemplar item. AS6171 will provide the counterfeit detection community with standardized test and inspection procedures, workmanship criteria, and minimum training and certification requirements to detect counterfeit electrical, electronic, and electromechanical parts.
Proceedings Papers
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 449-456, November 14–18, 2010,
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Schottky diodes are semiconductor switching devices with low forward voltage drops and very fast switching speeds. This paper provides an overview of the common failure modes in Schottky diodes and corresponding failure mechanisms associated with each failure mode. Results of material level evaluation on diodes and packages as well as manufacturing and assembly processes are analyzed to identify a set of possible failure sites with associated failure modes, mechanisms, and causes. A case study is then presented to illustrate the application of a systematic FMMEA methodology to the analysis of a specific failure in a Schottky diode package.