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B.M. Sweety
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Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 198-201, November 15–19, 2009,
Abstract
View Papertitled, In Situ Removal of Polyimide Layer Using Modified Decapsulator
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for content titled, In Situ Removal of Polyimide Layer Using Modified Decapsulator
Removal of polyimide layer after decapsulation of IC package is essential for many of the failure analysis techniques. An alternative method for polyimide removal is described in this paper. The method suggests appropriate modification of dual acid decapsulation system for this purpose. Device integrity is verified after removal of polyimide layer. This method becomes promising for devices which are sensitive / vulnerable for exposure to plasma.
