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1-4 of 4
Aslam A Khan
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Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2024) 26 (3): 14–24.
Published: 01 August 2024
Abstract
View articletitled, Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection
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for article titled, Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection
This article describes a proposed novel metric to furnish chip designers with a prognostic tool for x-ray imaging in the pre-silicon stage. This metric is fashioned to provide designers with a concrete measure of how visible the fine-pitched features of their designs are under x-ray inspection. It utilizes a combination of x-ray image data collection, analysis, and simulations to evaluate different design elements.
Proceedings Papers
ISTFA2023, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 346-351, November 12–16, 2023,
Abstract
View Papertitled, Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs - Exploring the Advantages of a Post-Photon Emission Technique
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for content titled, Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs - Exploring the Advantages of a Post-Photon Emission Technique
The increasing demand for semiconductor chips and the outsourcing of chip fabrication have heightened vulnerability to hardware security threats. While optical probing has been used extensively for semi-invasive/non-invasive attacks, its resolution limits and obsolescence in advanced technologies have necessitated exploring other techniques. Electron-beam probing (EBP) has emerged as a powerful method, offering 20x better spatial resolution than optical probing, and applies to sub- 7nm flip-chips and advanced 3D architecture systems. However, the increased resolution of EBP also poses a threat to sensitive information on these advanced chips, calling for developing countermeasures to secure assets. By understanding the capability of EBP, the potential of using EBP to extract sensitive data such as encryption keys, soft IP, neural network parameters, and proprietary algorithms will be discussed. This paper delves into the principles behind EBP, its capabilities, challenges for this technique, and potential applications in failure analysis and potential attacks. It highlights the need for developing effective countermeasures to protect sensitive information on advanced node technologies.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2022) 24 (2): 24–32.
Published: 01 May 2022
Abstract
View articletitled, Physical Security Roadmap for Heterogeneous Integration Technology
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for article titled, Physical Security Roadmap for Heterogeneous Integration Technology
Interposers play an important role in 2.5D and 3D packages, routing power and communication signals between dies while maintaining electrical contact with I/O pins. This role and their relatively simple construction makes interposers a target for malicious attacks. In this article, the authors assess the vulnerabilities inherent in the fabrication of interposers and describe various types of optical attacks along with practical countermeasures.
Journal Articles
Journal: EDFA Technical Articles
EDFA Technical Articles (2021) 23 (2): 4–12.
Published: 01 May 2021
Abstract
View articletitled, Security Assessment of IC Packaging Against Optical Attacks
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for article titled, Security Assessment of IC Packaging Against Optical Attacks
The inverted orientation of a flip-chip packaged die makes it vulnerable to optical attacks from the backside. This article discusses the nature of that vulnerability, assesses the threats posed by optical inspection tools and techniques, and provides insights on effective countermeasures.