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Alex Ngai
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Proceedings Papers
ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 1-5, November 15–19, 2009,
Abstract
View Papertitled, An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages
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for content titled, An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages
A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.
