A numerical investigation of the probabilistic approach in estimating the reliability of wire bonding is presented along with a reliability based design optimization methodology for microelectronic devices structures.

The influence of electric current flow and electrically induced Joule heat on thermal stress for weld joint cracks at both interfaces is still not fully comprehended. This article investigates the effect of subjecting the ball grid array package to a cyclic current input. Current density, Joule effect, and temperature curves are examined.