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Poster Session: Modeling and Simulation
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Proceedings Papers
Integrated Simulation of Low Pressure Plasma Spraying Process
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ITSC1999, Thermal Spray 1999: Proceedings from the United Thermal Spray Conference, 777-782, March 17–19, 1999,
Abstract
View Papertitled, Integrated Simulation of Low Pressure Plasma Spraying Process
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In this paper, a comprehensive mathematical model is developed for the integrated simulation of the coating plasma spraying process under low pressure. This simulation models powder particles that are heated and moved in a plasma jet, the heat transfer in the "coating substrate" system, and the formation of thermal loads. Basic software is developed for the practical implementation of the model. The process of alumina spraying is simulated. Paper includes a German-language abstract.
Proceedings Papers
Numerical Results of Off-Angle Thermal Spray Particle Impact
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ITSC1999, Thermal Spray 1999: Proceedings from the United Thermal Spray Conference, 783-786, March 17–19, 1999,
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This paper presents results regarding the influence of the spray angle on the spray shape. Simulations of the liquid dynamics of the impact of Ni particles, which were the characteristic of both HVOF and DC plasma conditions, are carried out. The results show that the splashes stretch with decreasing spray angle and confirm previous experimental observations to the effect that the splash area varies little with the spray angle. In addition, the results indicate that more than 90% of the material is applied "behind" the point of impact, even at spray angle is equal to 45 degree. Paper includes a German-language abstract.
Proceedings Papers
Numerically Calculated Thermal Stresses in Thermal Barrier Coatings on Cylindrical Substrates
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ITSC1999, Thermal Spray 1999: Proceedings from the United Thermal Spray Conference, 787-792, March 17–19, 1999,
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View Papertitled, Numerically Calculated Thermal Stresses in Thermal Barrier Coatings on Cylindrical Substrates
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In the case of thermal insulation layers, chipping is often observed at the end of the blade, where the curve radii are very small. This failure is likely to be caused by tensile stresses perpendicular to the interface and by compressive circumferential stresses in convexly curved layers. A finite element method was used to calculate the stresses that build up during a heat cycle. The system examined consisted of a cylindrical substrate, an adhesive layer, and the APS thermal insulation layer. The viscoelastic properties of the materials were taken into account, which lead to stress relaxation of the samples, which is often determined by experiment. Creep data and modulus of elasticity of the thermal insulation layers show a large range of variation. This paper shows the influence of these broad variations on the development of the state of stress in the thermal insulation layers during a single thermal cycle. Paper includes a German-language abstract.
Proceedings Papers
Modeling of Simultaneous Plasma Spraying of Two Powders
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ITSC1999, Thermal Spray 1999: Proceedings from the United Thermal Spray Conference, 793-798, March 17–19, 1999,
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This paper presents a simulation of the simultaneous spraying of a metal and a ceramic powder with different configurations for the injection of the powder into the plasma jet. The plasma jet and the behavior of the injected particles were modeled with a commercially available computational model of the dynamics of liquid bodies. The particles are modeled as discrete Lagrangian objects. Three series of numerical tests were carried out: simultaneous spraying of the powder in a three-dimensional plasma jet in a stable state; simulation of the 3-D plasma flow, assuming that it fluctuates at the same frequency as the arc voltage; and simulation of the effect of the current fluctuation on particle behavior. A pre-calculation with an analytical model made it possible to determine the suitable gas flow rate so that the "average" trajectories of the metal or ceramic powders coincide at the same point on the surface. Paper includes a German-language abstract.