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J. Xu
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Proceedings Papers
ITSC2000, Thermal Spray 2000: Proceedings from the International Thermal Spray Conference, 195-201, May 8–11, 2000,
Abstract
PDF
A numerical model is developed to study the effects of the contact resistance, droplet impacting droplet temperature, and substrate temperature on the droplet solidification rate and temperature of the droplet under the condition when the substrate can melt and re-solidify. Two-dimensional simulations show that the interface velocity is small in the area of poor contact with an irregular solidification interface shape. During the impact of Molybdenum on a steel substrate, Mo solidifies while the steel substrate melts.