Abstract
An optimized powder/suspension based atmospheric Plasma Spray (PS) process, using a Triplex Pro 210TM torch, was implemented to elaborate Cu:TiO2 surface coatings on stainless steel. Nanometric Degussa P25TM powder was prepared in a water-based suspension and co-sprayed with a Cu spheroidal powder. The bacterial reduction, evaluated with 1h-exposure to Escherichia Coli (E. Coli), was two times higher for the Cu:TiO2 coating compared to the bare stainless steel substrate. Since the coatings obtained by plasma spray are relatively porous, their antibacterial efficacy was compared to smooth Ag and Cu doped titanium nitride (TiN) films obtained by physical vapor deposition technique (PVD). For the same exposure time, the PVD smooth coatings showed a much lower antibacterial efficacy proving the topography effect on bacterial adhesion.
