Cold Spray Coatings for Spacecrafts Low-Temperature Soldering Application

In this study, cold sprayed Cu approximately 40 to 60 μm in thickness is deposited on 6063 and LD10 aluminum plate to improve wettability for low temperature soldering and to serve as a barrier layer to protect the substrate from gallium diffusion originating in the solder paste. The effect of the coating on wettability, diffusion, solder joint interface microstructure, and shear strength is investigated in detail.