On the Behavior of Thick and Porous Copper Deposits Under Compressive Stress Available to Purchase

Pure copper thick deposits were vacuum plasma sprayed in such a way that several porosity levels were obtained. Mechanical compressive tests permitted to assess the mechanical behavior of these materials and to study the associated pore microstructural changes. A linear porosity level decrease was observed during the first stages of the compressive squeezing, until the stress reached a specific value corresponding to a transition between pore contraction and copper splats deformation. Stereological measurements showed that the pore squeezing was isotropic.