Different directions characterize the advances being made in thermal spraying today. On the one hand, spray processes are becoming colder, on the other hand, high-performance systems are being designed which enable a higher powder throughput, thus making production faster and more efficient. The current spectrum of substrate materials is much broader and even more versatile, as can be seen with new materials which prevent thermal stresses from arising during the production process. More and more applications require the use of special cooling methods to increase the cooling efficiency and, in turn, optimize the process. An ongoing objective of the gas industry is to offer the user hardware which not only exploits all the advantages of CO2, for example, but which is also suited to new applications.

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