A new plasma chemical process has been found that produces tungsten thin films. Using fine powders or precursors as feedstocks, the process vaporizes the feedstocks and then deposits nanometer size grains. The deposition kinetics of structures produced with this technique vary greatly from classical plasma spraying methods. Equiaxed and columnar grains (30-150 nm) are formed instead of splat structures, although the grains may continue to grow after spraying.

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