A direct write method of fabricating antenna structures onto doubly curved dielectric surfaces has been developed using low temperature kinetic metallization. This paper describes the process and its use for depositing copper on various dielectrics and silver on alumina substrates and copper lead frames.

antenna structures, copper coatings, dielectric surfaces, kinetic metallization, silver coatings
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Copyright © 2009 ASM International. All rights reserved.
2009
ASM International
Topics
Copper powder Silver powder Alumina ceramics Cold spray coating
Issue Section:
Applications and Case Studies
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