Metal and Non-Metal Film Formation Using Atmospheric Aerosol Spray Method

A low-temperature, atmospheric-pressure spraying process was recently developed that facilitates the formation of highly functional films on any type of substrate using metal or nonmetal powders. This paper describes the new process and explains how different parameters, such as spraying distance, exit gas velocity, nozzle diameter, and particle size, affect the thickness, area, and composition of copper and barium titanate films on alumina, copper clad, and wafer substrates.