Effect of Substrate Roughness on the Deposition Behavior of Kinetic Sprayed Copper Particles on Copper Substrate

In this work, effect of substrate roughness on the deposition behavior of the particles through kinetic spray technology is studied. Finite element analysis program, ABAQUS 6.7-2 was used to estimate the results. Particle impact on the planar and roughened substrates were analyzed and compared. Interface temperature, contact area and contact time were found to be higher for the particle impact on roughened surfaces than that of the planar one for constant spray condition. These factors are significant for bonding mechanism. Experiments were performed on the polished and grit blasted surfaces in order to compare the results. The deposition efficiency and the bond strength values were used to evaluate the effect of surface roughness.