In this paper, copper coatings were deposited on a metallic substrate by means of multi-function micro-plasma spraying under different processing parameters. The microstructure and phase structure of copper coatings were investigated using a scanning electron microscope and X-ray diffraction, bonding strength were tested by an electron tensile tester, droplet impinging and flattening on a flat substrate surface and the residual stress after solidification were studied numerically. The experimental results show that the density of copper coatings was improved with increasing plasma power and operating gas flow, and this copper coating possessed high adhesion strength and low residual stress, still without obvious oxidation. This spraying system extends the application field of tradition plasma spray. Through changing the processing parameters, materials with different melting points, even as low as copper can be produced.

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