An advanced closed loop control system that enables tight control of the particle and substrate states has been developed. This unique capability allows deposition of coatings under very controlled conditions. This enables the construction of detailed process/property maps that can lead to a fundamental understanding of the formation mechanisms of key microstructural features during the plasma deposition process. The microstructural development during processing is discussed in light of the physics of microcrack formation during plasma deposition, including the effect of particle and substrate states on splat solidification, thermal gradients and residual stresses.

This content is only available as a PDF.
You do not currently have access to this content.