Electrostatic chucks are a potential alternative to vacuum stages used in semiconductor manufacturing. They have no moving parts; just a thin dielectric layer on an aluminum substrate. This paper explains how the dielectric coating for an electrostatic wafer holder was developed, tested, and optimized for commercial use. It describes the materials (Al2O3-TiO2) and spraying method (VPS) used, the rationale for selecting them, and the metrics on which they are rated. It explains how to verify that the layers have sufficient resistivity, adsorption properties, and thickness to satisfy application requirements. It also discusses the deoxidation of TiO2 during spraying and its effect on electrical properties. Paper includes a German-language abstract.