This paper presents the Laser Shock Adhesion Test technique developed to obtain a non-intrusive bond strength test. This technique uses a high-power laser to generate shock in the substrate, so that a voltage is generated in the boundary layer and laser Doppler interferometry is used for diagnosis on the back of the layer in order to detect detachment. The advantages and disadvantages of this technique are discussed. To illustrate the technique, results on a copper/aluminum system are presented and discussed. Experimental results are obtained on a thermally sprayed copper layer on an aluminum substrate. Experimental results are correlated with numerical simulations of shock waves propagation. The goal is to detect the adhesion threshold making shots on samples by increasing the energy of the laser pulse. The threshold can be detected between the last shot where no damage is measured and the first one where damages appear. Paper includes a German-language abstract.