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Proceedings Papers

ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis

AI Applications for Failure Analysis

Boards and Systems

Case Studies and Device Analysis

Process and Workflow Case Studies

Detecting and Preventing Counterfeit Microelectronics

Die Level Fault Isolation

Emerging FA Techniques and Concepts

Poster Session

FIB Circuit Analysis and Edit

FIB Sample Preparation

Hardware Attacks, Security, and Reverse Engineering

Microscopy Analysis and Materials Characterization

Nanoprobing and Electrical Characterization II

Package Level Fault Isolation

Packaging and Assembly

Power Devices (Si, SiC, GaN)

Product Yield, Test, and Diagnostics

Sample Preparation and Device Deprocessing

Scanning Probe Analysis

System in Package and 3D Devices

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