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ISTFA 2024: Conference Proceedings from the 50th International Symposium for Testing and Failure Analysis

AI Applications for Failure Analysis

Enhancing Semiconductor Nanoprobing Procedures with AI-Driven Tip Detection

David Stefan Kleindiek; Matthias Kemmler; Andreas Zell

ISTFA 2024; 1-4https://doi.org/10.31399/asm.cp.istfa2024p0001

View Articletitled, Enhancing Semiconductor Nanoprobing Procedures with AI-Driven Tip Detection

Few-Shot AI Segmentation of Semiconductor Device FIB-SEM Tomography Data

Heiko Stegmann; Flavio Cognigni

ISTFA 2024; 13-21https://doi.org/10.31399/asm.cp.istfa2024p0013

View Articletitled, Few-Shot AI Segmentation of Semiconductor Device FIB-SEM Tomography Data

Optical Automated Interconnect Inspection of Printed Circuit Boards

Patrick Craig; Jonathan Pearson; Shajib Ghosh; Nitin Varshney; Sanjeev J. Koppal; Navid Asadizanjani

ISTFA 2024; 22-27https://doi.org/10.31399/asm.cp.istfa2024p0022

View Articletitled, Optical Automated Interconnect Inspection of Printed Circuit Boards

Automating Routing of Product Returns for Failure Analysis with Neuro-Symbolic AI

Felix Mitterer; Christian Burmer; Konstantin Schekotihin

ISTFA 2024; 47-52https://doi.org/10.31399/asm.cp.istfa2024p0047

View Articletitled, Automating Routing of Product Returns for Failure Analysis with Neuro-Symbolic AI

Poster Session

The Advanced Failure Analysis Methods Based on Dynamic Hot Electron Analyzer and IDD3P Measurements for HKMG Sub-nm DRAM

Sunah Lee; Jihoon Son; Jihoon Park; Bohyeon Jeon; Seokmin Yun; Chaesoo Kim; Hagyeong Kwon; Jayoung Lee; Sangjun Kim; Ilwoo Jung; SeGuen Park

ISTFA 2024; 5-8https://doi.org/10.31399/asm.cp.istfa2024p0005

View Articletitled, The Advanced Failure Analysis Methods Based on Dynamic Hot Electron Analyzer and IDD3P Measurements for HKMG Sub-nm DRAM

Application of the Attention-Guided Neural Network for Defect Detection

Alexey Solovey; Chuan Zhang; Jane Y. Li

ISTFA 2024; 9-12https://doi.org/10.31399/asm.cp.istfa2024p0009

View Articletitled, Application of the Attention-Guided Neural Network for Defect Detection

Enhanced Dynamic Laser Stimulation Method for Fault Isolation

Keonil Kim; Kyunghoon Shin; Ghil-Geun Oh

ISTFA 2024; 39-41https://doi.org/10.31399/asm.cp.istfa2024p0039

View Articletitled, Enhanced Dynamic Laser Stimulation Method for Fault Isolation

EOS Failure in Low-Voltage Core Circuits during Latch-up Test at I/O Pins

Chen-Wei Hsu; Ming-Dou Ker; Ping-Lin Chung; Chin-Tung Cheng; Chih-Ping Chen

ISTFA 2024; 42-46https://doi.org/10.31399/asm.cp.istfa2024p0042

View Articletitled, EOS Failure in Low-Voltage Core Circuits during Latch-up Test at I/O Pins

Application of Advanced Dynamic Photon Emission Microscopy with Programmable Tester for Functional Failure Analysis of DRAM Devices

Hagyeong Kwon; Chae Soo Kim; Sunah Lee; Jihoon Park; Jihoon Son; Jeonghoon Baek; Seungchul Yew; Dong In Lee; Byeongheon Lee

ISTFA 2024; 70-73https://doi.org/10.31399/asm.cp.istfa2024p0070

View Articletitled, Application of Advanced Dynamic Photon Emission Microscopy with Programmable Tester for Functional Failure Analysis of DRAM Devices

Narrowing the Launch and Capture Pulses for Detection of Marginal Defects

A.A. Merassi

ISTFA 2024; 87-89https://doi.org/10.31399/asm.cp.istfa2024p0087

View Articletitled, Narrowing the Launch and Capture Pulses for Detection of Marginal Defects

An Improved Backside Deprocessing Technique for Advanced IC Devices

Susan Li; Jose Hulog; Zhaofeng Wang; Shixian Sui; Ming Zhang; Armen Andreasyan; Yeow Shen Goh

ISTFA 2024; 161-164https://doi.org/10.31399/asm.cp.istfa2024p0161

View Articletitled, An Improved Backside Deprocessing Technique for Advanced IC Devices

Etching Monitoring of Advanced Forksheet Devices Using AKONIS SIMS Tool

A-S. Robbes; O. Dulac; K. Soulard; M. Adier; S. Choi; D. Jacobson; A. Merkulov; R. Tilmann; P.A.W. van der Heide; A. Franquet

ISTFA 2024; 175-176https://doi.org/10.31399/asm.cp.istfa2024p0175

View Articletitled, Etching Monitoring of Advanced Forksheet Devices Using AKONIS SIMS Tool

An Innovative Analytics Platform for High-Resolution 3D Ion Imaging and SIMS Nanoanalytics with Precise Sample Navigation

Peter Gnauck; Alexander Ost; Torsten Richter

ISTFA 2024; 188-190https://doi.org/10.31399/asm.cp.istfa2024p0188

View Articletitled, An Innovative Analytics Platform for High-Resolution 3D Ion Imaging and SIMS Nanoanalytics with Precise Sample Navigation

Application of Thermal Emission Phase Lock-In Image Statistics to Locate Defects in Z-depth for Advance 2.5D Packaging

Daniel Nuez; Phoumra Tan; Brian Lai

ISTFA 2024; 213-216https://doi.org/10.31399/asm.cp.istfa2024p0213

View Articletitled, Application of Thermal Emission Phase Lock-In Image Statistics to Locate Defects in Z-depth for Advance 2.5D Packaging

The Impact of TEM Analysis Temperature on Photoresist Profiles Using Cryo-FIB and Cryo-TEM

Ji Hye Hyun; Yanchao Dai; In Chang Choi; Christopher H. Kang

ISTFA 2024; 221-226https://doi.org/10.31399/asm.cp.istfa2024p0221

View Articletitled, The Impact of TEM Analysis Temperature on Photoresist Profiles Using Cryo-FIB and Cryo-TEM

Studying the FT-IR Spectra of Flux at Different Curing Conditions for Semiconductor Applications

Sharmeeni Murugan; Sangeetha Thiagarajan; Amirul Fakri; Imadudina; Anamarliha

ISTFA 2024; 227-230https://doi.org/10.31399/asm.cp.istfa2024p0227

View Articletitled, Studying the FT-IR Spectra of Flux at Different Curing Conditions for Semiconductor Applications

Introduction of a New EBAC Technique with Lamella-like Sample in DRAM Devices

HaYoung Choi; InChang Choi; Christopher H. Kang; EuiSeok Kim; JaeYun Lee; Muryeong Kim

ISTFA 2024; 266-272https://doi.org/10.31399/asm.cp.istfa2024p0266

View Articletitled, Introduction of a New EBAC Technique with Lamella-like Sample in DRAM Devices

A Comprehensive Approach for Post Silicon Unique Hold Time Violation Debug on Ethernet Interface Issue

Lee Shen Shen; Kuan Lai Khei; Wu Jia Jun; Goh Lay Lay; Tirthak Shah; Gaurav Gupta; Vinay Padmanabha Gayatri; Yuet Li

ISTFA 2024; 320-326https://doi.org/10.31399/asm.cp.istfa2024p0320

View Articletitled, A Comprehensive Approach for Post Silicon Unique Hold Time Violation Debug on Ethernet Interface Issue

SYSFID—System-Aware Fault-Injection Attack Detection for System-In-Package Architectures

Amit Mazumder Shuvo; Md Sami Ul Islam Sami; Md Latifur Rahman; Jingbo Zhou; Kimia Zamiri Azar; Farimah Farahmandi; Mark Tehranipoor

ISTFA 2024; 332-341https://doi.org/10.31399/asm.cp.istfa2024p0332

View Articletitled, SYSFID—System-Aware Fault-Injection Attack Detection for System-In-Package Architectures

Development of Novel Methods for Grinding and Polishing of 3DHI Devices

Ahmed Hasan; Scott Silverman

ISTFA 2024; 342-345https://doi.org/10.31399/asm.cp.istfa2024p0342

View Articletitled, Development of Novel Methods for Grinding and Polishing of 3DHI Devices

Automating Submicron IR Measurements for Failure Analysis

Jay Anderson; Michael K.F. Lo; Eoghan P. Dillon; Mustafa Kansiz

ISTFA 2024; 346-350https://doi.org/10.31399/asm.cp.istfa2024p0346

View Articletitled, Automating Submicron IR Measurements for Failure Analysis

A Quantitative and Automated Quality Metric for Delayering Integrated Circuits

Noah Padro; Tim Balint; Nick Harner; Jon Scholl; Yash Patel; Matt Sale; Adam Kimura

ISTFA 2024; 363-369https://doi.org/10.31399/asm.cp.istfa2024p0363

View Articletitled, A Quantitative and Automated Quality Metric for Delayering Integrated Circuits

Implementation of FIB Automation Methodologies for TEM Applications in Memory Devices

Sang Hoon Lee; Joshua-Adams Miller; Veronica Perez; Kenton Burns; Xue Rui; Shixin Wang; SookFun Chan; Ning Lu; Yun-Yu Wang; Qiang Jin; Robert Gifford; Tyler Lenzi; Cheng-Han Li; Sven Beunen

ISTFA 2024; 392-405https://doi.org/10.31399/asm.cp.istfa2024p0392

View Articletitled, Implementation of FIB Automation Methodologies for TEM Applications in Memory Devices

IC Backside Deprocessing Physical Failure Analysis with Laser Ablation Technique

P.K. Tan; S.L. Ting; Angela Teo; N.Y. Xu; Alfred Quah; Y.S. Tam; K.K. Kang; Jessica Oh; A.F. Roslan; Nivasini Thiruppathi; G. Wicaksono; H.H.W. Thoungh; T.T. Yu; P.T. Ng; C.Q. Chen

ISTFA 2024; 406-410https://doi.org/10.31399/asm.cp.istfa2024p0406

View Articletitled, IC Backside Deprocessing Physical Failure Analysis with Laser Ablation Technique

Statistical Degradation in BGAs for Early Fault Detection

Emmanuel Bender; Tsuriel Avraham; Joseph B. Bernstein; Duane S. Boning

ISTFA 2024; 440-446https://doi.org/10.31399/asm.cp.istfa2024p0440

View Articletitled, Statistical Degradation in BGAs for Early Fault Detection

Electrostatic Force Microscopy Technique for Understanding Failures in Polyimide Insulation Barriers

Srikanth Kolagatla; Sombel Diaham; Paul Lambkin; Ricky Anthony; Megan McCarthy; Subha Lakshmanan; Ramji Lakshmanan; Jer O’Sullivan

ISTFA 2024; 460-462https://doi.org/10.31399/asm.cp.istfa2024p0460

View Articletitled, Electrostatic Force Microscopy Technique for Understanding Failures in Polyimide Insulation Barriers

Advanced Package Sample Preparation Leveraging Precision CNC-Based Milling and Selective Microwave Induced Plasma Etching

Joseph Sanchez; Chuan Zhang; John Aguada; Jane Li; Jiaqi Tang; Chris Richardson

ISTFA 2024; 492-495https://doi.org/10.31399/asm.cp.istfa2024p0492

View Articletitled, Advanced Package Sample Preparation Leveraging Precision CNC-Based Milling and Selective Microwave Induced Plasma Etching

Inexpensive and Efficient Backside Decapsulation Technique for Challenging Down Bond Devices

Chaoliang Cheng; Jing Zhou

ISTFA 2024; 515-518https://doi.org/10.31399/asm.cp.istfa2024p0515

View Articletitled, Inexpensive and Efficient Backside Decapsulation Technique for Challenging Down Bond Devices

Nanoprobing and Electrical Characterization

SRAM Single Bit Cell Soft Failure and Nanoprobing Methods

Zhigang Song; Michael Tenney; Larry Fischer; Dave Albert

ISTFA 2024; 28-34https://doi.org/10.31399/asm.cp.istfa2024p0028

View Articletitled, SRAM Single Bit Cell Soft Failure and Nanoprobing Methods

Pluck-and-Probe Method for EBIRCH Isolation of Wordline Defects in 3D Replacement Gate NAND

Chandler Rich; Wayne Harlow; Becky Muñoz; Regino Sandoval; William Crow; Erik Jensen; J. Temo Davis; H M Ashfiqul Hamid

ISTFA 2024; 90-96https://doi.org/10.31399/asm.cp.istfa2024p0090

View Articletitled, Pluck-and-Probe Method for EBIRCH Isolation of Wordline Defects in 3D Replacement Gate NAND

Revolutionizing Failure Analysis: EBAC Nanoprobing Analysis Insights into Inaccessible Floating Gates of Advanced Tech Node Automotive NVMs

P.K. Tan; S.L. Ting; H.H.W. Thoungh; P.T. Ng; Alfred C.T. Quah; N.Y. Xu; T.T. Yu; Jessica Oh; Angela Teo; Y.S. Tam; K.K. Kang; C.Q. Chen

ISTFA 2024; 97-103https://doi.org/10.31399/asm.cp.istfa2024p0097

View Articletitled, Revolutionizing Failure Analysis: EBAC Nanoprobing Analysis Insights into Inaccessible Floating Gates of Advanced Tech Node Automotive NVMs

Temperature Sensitive Failure Characterization Using Thermal Nanoprobing

Zvika Sapir; Avraham Raz; Andin Orana

ISTFA 2024; 182-187https://doi.org/10.31399/asm.cp.istfa2024p0182

View Articletitled, Temperature Sensitive Failure Characterization Using Thermal Nanoprobing

Combining Electrical Fault Isolation and Electrical Characterization Inside an SEM to Locate and Characterize Gate Leakages on a 3 nm Device

Andreas Rummel; Matthias Kemmler; Klaus Schock; Andrew Smith; Stephan Kleindiek

ISTFA 2024; 255-258https://doi.org/10.31399/asm.cp.istfa2024p0255

View Articletitled, Combining Electrical Fault Isolation and Electrical Characterization Inside an SEM to Locate and Characterize Gate Leakages on a 3 nm Device

Failure Analysis of InGaAs/GaAs Nanoridge Lasers by Electron Beam Based Nanoprobing

Anjanashree M.R. Sharma; Ping-Yi Hsieh; Debi Prasad Panda; Kristof J.P. Jacobs; Didit Yudistira; Bernardette Kunert; Joris Van Campenhout; Jin Won Seo; Ingrid De Wolf; Jörg Jatzkowski; Frank Altmann

ISTFA 2024; 297-304https://doi.org/10.31399/asm.cp.istfa2024p0297

View Articletitled, Failure Analysis of InGaAs/GaAs Nanoridge Lasers by Electron Beam Based Nanoprobing

Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs

Gregory M. Johnson; Cheryl Hartfield; Andreas Rummel; Heiko Stegmann; Lorenz Lechner

ISTFA 2024; 478-484https://doi.org/10.31399/asm.cp.istfa2024p0478

View Articletitled, Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-Node SRAMs

Die Level Fault Isolation

Enhancing Soft Defect Localization with Software Automated Intelligent Laser Scanning (SAILS)

Arun Karunanithi; Joseph Caroselli; Winston Gao; Aaron Liao

ISTFA 2024; 35-38https://doi.org/10.31399/asm.cp.istfa2024p0035

View Articletitled, Enhancing Soft Defect Localization with Software Automated Intelligent Laser Scanning (SAILS)

Fast Laser Probing Using Gigahertz Digitizer

Lua Winson; Ravikumar Venkat-Krishan; Phoa Angeline

ISTFA 2024; 53-57https://doi.org/10.31399/asm.cp.istfa2024p0053

View Articletitled, Fast Laser Probing Using Gigahertz Digitizer

Power Devices (Si, SiC, GaN)

Optimizations and Case Studies—Decapsulation of Hardened Epoxy SiC MOSFETs and Diodes via JIACO Microwave Induced Plasma Etching

Connor J. Sorrells; Kyle E. Nielsen; Bret A. Walters; Jiaqi Tang; Mark W. McKinnon

ISTFA 2024; 58-69https://doi.org/10.31399/asm.cp.istfa2024p0058

View Articletitled, Optimizations and Case Studies—Decapsulation of Hardened Epoxy SiC MOSFETs and Diodes via JIACO Microwave Induced Plasma Etching

Identification and Characterization of Conductive Dislocations in p-GaN/AlGaN/GaN Heterojunctions on GaN-on-Si Substrates

M. Stabentheiner; D. Tilly; T. Schinnerl; A.A. Taylor; P. Javernik; M. Novak; C. Ostermaier; D. Pogany

ISTFA 2024; 146-152https://doi.org/10.31399/asm.cp.istfa2024p0146

View Articletitled, Identification and Characterization of Conductive Dislocations in p-GaN/AlGaN/GaN Heterojunctions on GaN-on-Si Substrates

Top-Down Junction Analysis in SiC

Gregory M. Johnson; Andreas Rummel; Pietro Paolo Barbarino; Giuseppe Sciuto; Massimiliano Astuto; Giancarlo Calvagno; Roberta Ricciari

ISTFA 2024; 463-468https://doi.org/10.31399/asm.cp.istfa2024p0463

View Articletitled, Top-Down Junction Analysis in SiC

Removal of Highly Doped Silicon for Backside Fault Isolation with Fluorine-Based Etches

Kevin Distelhurst; Jim Densmore; Jiaqi Tang

ISTFA 2024; 509-514https://doi.org/10.31399/asm.cp.istfa2024p0509

View Articletitled, Removal of Highly Doped Silicon for Backside Fault Isolation with Fluorine-Based Etches

Product Yield, Test, and Diagnostics

Addressing the Cost and Execution Challenges of Scan Chain Testing and Failure Analysis of Complex IC’s

Alexander Flor; Jeffrey S. Javier

ISTFA 2024; 74-78https://doi.org/10.31399/asm.cp.istfa2024p0074

View Articletitled, Addressing the Cost and Execution Challenges of Scan Chain Testing and Failure Analysis of Complex IC’s

FIB Sample Preparation

Targeted TEM SRAM-Like Analysis Without Delayering

J. Demarest; B. Austin; L. Tierney; Z. Martin

ISTFA 2024; 79-81https://doi.org/10.31399/asm.cp.istfa2024p0079

View Articletitled, Targeted TEM SRAM-Like Analysis Without Delayering

Utilizing PFIB for Preparing TEM Lamellae Tailored to High Aspect Ratio 3D NAND Structures

Yu-Chih Chen; Zhao-Ling Wu; Bo-Hao Chiou; Chun-Hung Lin; Hsin-Cheng Hsu; Chin-Chih Yeh; Nan-Tzu Lian; Ta-Hone Yang; Kuang-Chao Chen

ISTFA 2024; 82-86https://doi.org/10.31399/asm.cp.istfa2024p0082

View Articletitled, Utilizing PFIB for Preparing TEM Lamellae Tailored to High Aspect Ratio 3D NAND Structures

Increasing TEM Prep Throughput with an Extendable Manipulator Tip

Valerie Brogden; Jeff Garman; Kurt Langworthy; Steve Wiemholt

ISTFA 2024; 153-156https://doi.org/10.31399/asm.cp.istfa2024p0153

View Articletitled, Increasing TEM Prep Throughput with an Extendable Manipulator Tip

Flexible Application of Multispecies Plasma-FIB in Failure Analysis Workflows

Melissa Mullen; Adam Stokes; Jared Johnson; Andrew Lam; Samuel Benson

ISTFA 2024; 165-168https://doi.org/10.31399/asm.cp.istfa2024p0165

View Articletitled, Flexible Application of Multispecies Plasma-FIB in Failure Analysis Workflows

Enhanced TEM Specimen Preparation for STEM-EBIC Analysis Using a Ga FIB system Followed by Post-FIB Ar Ion Beam Milling

C.S. Bonifacio; R. Li; M.L. Ray; P.E. Fischione; William Hubbard

ISTFA 2024; 191-199https://doi.org/10.31399/asm.cp.istfa2024p0191

View Articletitled, Enhanced TEM Specimen Preparation for STEM-EBIC Analysis Using a Ga FIB system Followed by Post-FIB Ar Ion Beam Milling

Emerging Failure Analysis Techniques and Concepts

Simultaneous Thermomechanical Mapping via Optical Pumping for Subsurface Defect Identification

Amun Jarzembski; Wyatt Hodges; Aleem Siddiqui; Matt Bahr; Luke Yates; Greg Pickrell

ISTFA 2024; 104-107https://doi.org/10.31399/asm.cp.istfa2024p0104

View Articletitled, Simultaneous Thermomechanical Mapping via Optical Pumping for Subsurface Defect Identification

CMOS Integrated Circuit Analysis Using Superconducting Nanowire Single-Photon Detectors

Ravin A. Chowdhury; Jeff Chiles; Brandon Cage; Saeed Khan; Richard P. Mirin; Ryan O'Loughlin; Martin J. Stevens; Jeffrey M. Shainline

ISTFA 2024; 119-124https://doi.org/10.31399/asm.cp.istfa2024p0119

View Articletitled, CMOS Integrated Circuit Analysis Using Superconducting Nanowire Single-Photon Detectors

Solving Complex Electrical Fault Isolation Challenges with Innovative DFT Strategies

Lesly Endrinal; Rakesh Kinger; Wilson Pradeep; Shruti Mittal; Jehan Saujauddin; Sean Ho; Jyotika Suri; Atul Chittora; Mark Kassab; Peter Orlando

ISTFA 2024; 125-134https://doi.org/10.31399/asm.cp.istfa2024p0125

View Articletitled, Solving Complex Electrical Fault Isolation Challenges with Innovative DFT Strategies

Localization of Subtle Front-End FinFET Defects Using EBIC

Nick Pronin; Khiem Ly; Tony Chrastecky; Jacob Levenson; Eric Yi; Kris Dickson; Sam Subramanian; Keith Serrels

ISTFA 2024; 205-212https://doi.org/10.31399/asm.cp.istfa2024p0205

View Articletitled, Localization of Subtle Front-End FinFET Defects Using EBIC

Nitrogen Vacancy Quantum Sensing for Current Density Imaging with Sub 30 nm Resolution

G. Puebla Hellmann; B. Josteinsson; S. Josephy; A. Morales

ISTFA 2024; 217-220https://doi.org/10.31399/asm.cp.istfa2024p0217

View Articletitled, Nitrogen Vacancy Quantum Sensing for Current Density Imaging with Sub 30 nm Resolution

Frequency-Tunable Current Imaging using a Quantum-Mixer Microscope Based on Nitrogen-Vacancy Centers in Diamond

Samuel Karlson; Pauli Kehayias; Jennifer M. Schloss; Andrew C. Maccabe; David F. Phillips; Guoqing Wang; Paola Cappellaro; Danielle A. Braje

ISTFA 2024; 282-287https://doi.org/10.31399/asm.cp.istfa2024p0282

View Articletitled, Frequency-Tunable Current Imaging using a Quantum-Mixer Microscope Based on Nitrogen-Vacancy Centers in Diamond

Heterogeneous Integrated Failure Analysis Using Radio Frequency Signal Detection/Injection with Power Spectrum Analysis

Joel T. Christiansen; Jeremy A. Walraven; Flora A. Coleman; Edmund H. Smith; Edward I. Cole

ISTFA 2024; 501-508https://doi.org/10.31399/asm.cp.istfa2024p0501

View Articletitled, Heterogeneous Integrated Failure Analysis Using Radio Frequency Signal Detection/Injection with Power Spectrum Analysis

E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes

Jennifer J. Huening; Xianghong Tom Tong; Shuai Zhao; Ravi Thirugnanasambandam; Yunfei Wang; Hyuk Ju Ryu; Prasoon Joshi; Mitchell J. Senger; May Ling Oh; Renliang Yuan; Jacob Waelder; Anil Matte; Baohua Niu; Zhiyong Ma; Neel Leslie; James Vickers

ISTFA 2024; 519-522https://doi.org/10.31399/asm.cp.istfa2024p0519

View Articletitled, E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes

Boards and Systems

Fault Isolation and Failure Analysis of Power Distribution Networks in PCBs

Pradip Sairam Pichumani; Zafar Farooqui; Mike Schnecker; Jeff Cuyle

ISTFA 2024; 108-114https://doi.org/10.31399/asm.cp.istfa2024p0108

View Articletitled, Fault Isolation and Failure Analysis of Power Distribution Networks in PCBs

Failure Analysis of Liquid Cooling Setup for Hyperscale Datacenter Infrastructure

Pradip Sairam Pichumani; Ting Yan; Eoghan Dillon

ISTFA 2024; 305-311https://doi.org/10.31399/asm.cp.istfa2024p0305

View Articletitled, Failure Analysis of Liquid Cooling Setup for Hyperscale Datacenter Infrastructure

Short Stories—Isolating Shorts in Circuit Boards

Stephen Fasolino; Will Cardle; Jason Wheeler

ISTFA 2024; 422-426https://doi.org/10.31399/asm.cp.istfa2024p0422

View Articletitled, Short Stories—Isolating Shorts in Circuit Boards

Case Studies: Failure Analysis Process and Workflows

EBIC at Cross-Section

Yuyan Wang; Drew Wheeler; Rafeal Huerta; Usha Bhimavarapu

ISTFA 2024; 115-118https://doi.org/10.31399/asm.cp.istfa2024p0115

View Articletitled, EBIC at Cross-Section

Innovative Fault Localization Techniques for ATPG Failures in Wire-Bonded BGA Packages

Lorenzo Lanzanova

ISTFA 2024; 135-139https://doi.org/10.31399/asm.cp.istfa2024p0135

View Articletitled, Innovative Fault Localization Techniques for ATPG Failures in Wire-Bonded BGA Packages

Integrating Multimodal Microscopy and Artificial Intelligence Solutions for Laser Dicing Process Induced Defect Identification

Flavio Cognigni; Giulio Lamedica; Domenico Mello; Philippe Von Gunten; Guillaume Fiannaca; Heiko Stegmann; Anton du Plessis; Marco Rossi

ISTFA 2024; 273-281https://doi.org/10.31399/asm.cp.istfa2024p0273

View Articletitled, Integrating Multimodal Microscopy and Artificial Intelligence Solutions for Laser Dicing Process Induced Defect Identification

High Contact Resistance from Preferential Oxidation of Silane Gas

Wentao Qin; Esteban Ortiz; Brandon Lent; Tim McGrady; Golnaz Yousefi; Randy Yach; Avik Chunder; Denise Barrientos; Manny Espinosa; Al Merino; Christine Janasky; Tina-cook Ruiz; Andy Blemker

ISTFA 2024; 447-453https://doi.org/10.31399/asm.cp.istfa2024p0447

View Articletitled, High Contact Resistance from Preferential Oxidation of Silane Gas

Sample Preparation and Device Deprocessing

Cross-Sectional Passive Voltage Contrast Technique on FinFET Metal-Gate Breakdown Defect Isolation and Visualization for TEM Analysis

S.L. Ting; P.K. Tan; P.T. Ng; C.Q. Chen

ISTFA 2024; 140-145https://doi.org/10.31399/asm.cp.istfa2024p0140

View Articletitled, Cross-Sectional Passive Voltage Contrast Technique on FinFET Metal-Gate Breakdown Defect Isolation and Visualization for TEM Analysis

Innovative Sample Preparation for Nano-Probing at Pixel Level in 3D BSI Imaging Products

Sophie Martin; Alexandre Jacquier; Emmanuel Petit; Philippe Larre

ISTFA 2024; 248-254https://doi.org/10.31399/asm.cp.istfa2024p0248

View Articletitled, Innovative Sample Preparation for Nano-Probing at Pixel Level in 3D BSI Imaging Products

Using FIB Grooving to Prepare Top-down-Nanoprobed Sample for Site-Specific Cross-Sectional Nanoprobing Analysis

S.L. Ting; P.K. Tan; T.T. Yu; P.T. Ng; C.Q. Chen

ISTFA 2024; 411-415https://doi.org/10.31399/asm.cp.istfa2024p0411

View Articletitled, Using FIB Grooving to Prepare Top-down-Nanoprobed Sample for Site-Specific Cross-Sectional Nanoprobing Analysis

Novel Backside IC Preparation Stopping on STI with Full Circuit Functionality Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry

Norbert Herfurth; Awwal A. Adesunkanmi; Abdelkhalek Bouchtouq; Gerfried Zwicker; Christian Boit

ISTFA 2024; 416-421https://doi.org/10.31399/asm.cp.istfa2024p0416

View Articletitled, Novel Backside IC Preparation Stopping on STI with Full Circuit Functionality Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry

Case Studies: Device Analysis

Analysis of 3row Failure Caused by Vulnerable Data Retention Failure Adjacent to Disconnected BCAT

Jongwon Nam; Youmin Kim; Jinhyeon Han; Sangho Kim; Hyunhee Jo; Seaeun Park; Kanghyuk Lee; Jihoon Kim; Ilwoo Jung; Dongin Lee; Byunghyun Lee; SeGuen Park

ISTFA 2024; 157-160https://doi.org/10.31399/asm.cp.istfa2024p0157

View Articletitled, Analysis of 3row Failure Caused by Vulnerable Data Retention Failure Adjacent to Disconnected BCAT

Polysilicon Line Damage and Burn-In Effectiveness in a 0.18 µm Mixed Signal Product

Jean-Philippe Manceau; Patrick Krenn; Isabella Hofer; Thomas Jost; Josef Ehgartner; Bastian Friesenbichler; Klaus-Peter Tschernay; Dann Evasco; Noel Lastima; Monica Giardi

ISTFA 2024; 177-181https://doi.org/10.31399/asm.cp.istfa2024p0177

View Articletitled, Polysilicon Line Damage and Burn-In Effectiveness in a 0.18 µm Mixed Signal Product

Lock-in Amplifier Applications for Fault Isolation

Sukho Lee; Kristofor Dickson

ISTFA 2024; 377-384https://doi.org/10.31399/asm.cp.istfa2024p0377

View Articletitled, Lock-in Amplifier Applications for Fault Isolation

Effective FA Approach in Uncovering Gate-to-D/S Tungsten Spur Fabrication Defect

Alex Marionne del Castillo; Alfred Jay Rafael; Jolina May Matibag; Jae Saladar; Robin Evangelista; Raymond Mendaros

ISTFA 2024; 427-433https://doi.org/10.31399/asm.cp.istfa2024p0427

View Articletitled, Effective FA Approach in Uncovering Gate-to-D/S Tungsten Spur Fabrication Defect

System in Package and 3D Devices

X-Ray Nanotomography Enabling Submicron Resolution Failure Analysis for Advanced Packaging

Till Dreier; Daniel Nilsson; Julius Hållstedt; Jesper Wittborn

ISTFA 2024; 169-174https://doi.org/10.31399/asm.cp.istfa2024p0169

View Articletitled, X-Ray Nanotomography Enabling Submicron Resolution Failure Analysis for Advanced Packaging

Failure Investigation of Copper-to-Copper Bonding in Advanced 3D Packaging—From Sample Preparation to Structural Characterization

Pawel Nowakowski; Richard Wei-Chih Li; Mary Ray; Paul Fischione

ISTFA 2024; 200-204https://doi.org/10.31399/asm.cp.istfa2024p0200

View Articletitled, Failure Investigation of Copper-to-Copper Bonding in Advanced 3D Packaging—From Sample Preparation to Structural Characterization

Innovations in Beam-Based Defect Localization Methods for Advanced 3D Interconnects

K.J.P. Jacobs; E. Beyne; T. Matsumoto; S. Tominaga; H. Terada

ISTFA 2024; 231-241https://doi.org/10.31399/asm.cp.istfa2024p0231

View Articletitled, Innovations in Beam-Based Defect Localization Methods for Advanced 3D Interconnects

Application of Visible ThermoDynamic Imaging Technology for Hotspot Detection in Failure Analysis

Shimpei Tominaga; Norimichi Chinone; Akihito Uchikado; Yuhei Aoshima; Tomonori Nakamura; Toru Matsumoto; Yunki Jung; Sungho Lee; Sangmin Han; Hyeongki Kim; Masataka Ikesu

ISTFA 2024; 242-247https://doi.org/10.31399/asm.cp.istfa2024p0242

View Articletitled, Application of Visible ThermoDynamic Imaging Technology for Hotspot Detection in Failure Analysis

Concept-Proof of Lock-in OBIRCH Application for Three-Dimensional Analysis of Four-Dimensional NAND Flash Memory

Norimichi Chinone; Akihito Uchikado

ISTFA 2024; 327-331https://doi.org/10.31399/asm.cp.istfa2024p0327

View Articletitled, Concept-Proof of Lock-in OBIRCH Application for Three-Dimensional Analysis of Four-Dimensional NAND Flash Memory

Hardware Security and Counterfeiting

Exploring the Effectiveness of Combining Electron-Beam Probing and Optical Techniques in a 16 nm Technology Device

Antonio Saavedra; Elham Amini; Jörg Jatzkowski; Tuba Kiyan; Lars Renkes; Christian Boit; Frank Altmann; Sebastian Brand; Jean-Pierre Seifert

ISTFA 2024; 259-265https://doi.org/10.31399/asm.cp.istfa2024p0259

View Articletitled, Exploring the Effectiveness of Combining Electron-Beam Probing and Optical Techniques in a 16 nm Technology Device

Evaluation of the Analyzability of Complex Secure Intellectual Property Using Fault Isolation Techniques versus the Hardware Security Threat They Pose

Amrutha Sampath; Kristofor Dickson; George W. Lange; Carey Wu; Keith A. Serrels

ISTFA 2024; 385-391https://doi.org/10.31399/asm.cp.istfa2024p0385

View Articletitled, Evaluation of the Analyzability of Complex Secure Intellectual Property Using Fault Isolation Techniques versus the Hardware Security Threat They Pose

Wafer Level Monitoring

Wafer Level Monitoring of Optical Insertion Loss during Silicon Photonics Manufacturing

Felix Beaudoin; Takako Hirokawa; Yusheng Bian; Thomas Houghton; Yarong Lin; Kenneth Shea; Brian Popielarski; Norman Robson; Aaron Sinnott; Neil V. Sapra; Golam Bappi; John Fini

ISTFA 2024; 288-291https://doi.org/10.31399/asm.cp.istfa2024p0288

View Articletitled, Wafer Level Monitoring of Optical Insertion Loss during Silicon Photonics Manufacturing

Package Level Fault Isolation

RF-LIT Use Case Studies

Marc van Veenhuizen; Eric Meeuwsen; Keying Lin; Maarten Nab; Mohammed Achour; Pieter Gommers; Varun Thukral

ISTFA 2024; 292-296https://doi.org/10.31399/asm.cp.istfa2024p0292

View Articletitled, RF-LIT Use Case Studies

A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages

Yu-Jen Chang; Cheng-Hsin Liu; Yi-Sheng Lin; Chen-Chao Wang; Nicky Liu; Bessy Chiu; Allen Gu

ISTFA 2024; 312-316https://doi.org/10.31399/asm.cp.istfa2024p0312

View Articletitled, A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages

Advanced Package Fault Simulation—The Impact of Accelerated Trace Model Generation

Chuan Zhang; John Aguada; Joseph Sanchez; Arpan Bhattacherjee; Jane Y. Li

ISTFA 2024; 469-477https://doi.org/10.31399/asm.cp.istfa2024p0469

View Articletitled, Advanced Package Fault Simulation—The Impact of Accelerated Trace Model Generation

FA Challenges and Case Study Exploration of Multidie Fan-Out Wafer Level Packages

Bernice Zee; Qiu Wen; Syahirah Mohammad-Zulkifli

ISTFA 2024; 496-500https://doi.org/10.31399/asm.cp.istfa2024p0496

View Articletitled, FA Challenges and Case Study Exploration of Multidie Fan-Out Wafer Level Packages

Microscopy Analysis and Material Characterization

Imaging Nanoscale Electronic Changes in a Biased GaN HEMT

William A Hubbard; B.C. Regan

ISTFA 2024; 317-319https://doi.org/10.31399/asm.cp.istfa2024p0317

View Articletitled, Imaging Nanoscale Electronic Changes in a Biased GaN HEMT

The Impact of Varying TEM Accelerating Voltage on Elemental Analysis of Semiconductor Defects

Jacob Levenson; Swaminathan Subramanian; Khiem Ly; Tony Chrastecky; Eric Yi

ISTFA 2024; 358-362https://doi.org/10.31399/asm.cp.istfa2024p0358

View Articletitled, The Impact of Varying TEM Accelerating Voltage on Elemental Analysis of Semiconductor Defects

Unlocking Insights into 3D Transistor Defects: The Power of Supplementing TEM with Elemental Electron Tomography

Yu Zhang; Kevin Davidson; Po-Cheng Lu; Frieder Baumann; Travis Mitchell

ISTFA 2024; 374-376https://doi.org/10.31399/asm.cp.istfa2024p0374

View Articletitled, Unlocking Insights into 3D Transistor Defects: The Power of Supplementing TEM with Elemental Electron Tomography

Advancing Quantitative Failure Analysis and Strain Measurements at the Nanoscale by Using Scanning Electron Diffraction Microscopy Enhanced by Beam Precession

Tomáš Morávek; Eduardo Serralta; Lukáš Hladík; Narendraraj Chandran; Daniel Němeček; Robert Stroud

ISTFA 2024; 434-439https://doi.org/10.31399/asm.cp.istfa2024p0434

View Articletitled, Advancing Quantitative Failure Analysis and Strain Measurements at the Nanoscale by Using Scanning Electron Diffraction Microscopy Enhanced by Beam Precession

Scanning Probe Analysis

Machine Learning for Predicting DataCube Atomic Force Microscope (AFM)—MultiDAT-AFM

Rosine Coq Germanicus; El-Hassani Othman

ISTFA 2024; 351-357https://doi.org/10.31399/asm.cp.istfa2024p0351

View Articletitled, Machine Learning for Predicting DataCube Atomic Force Microscope (AFM)—MultiDAT-AFM

Scanning Capacitance Microscopy Application for Top-down Sample Failure Analysis on SOI and Bulk Silicon Wafers

Zin Nwe Tun; Ryan Sweeney; Kevin Davidson; Esther Chen

ISTFA 2024; 370-373https://doi.org/10.31399/asm.cp.istfa2024p0370

View Articletitled, Scanning Capacitance Microscopy Application for Top-down Sample Failure Analysis on SOI and Bulk Silicon Wafers

AFM-in-SEM for Precise Endpoint Delayering of SRAMs

Gregory M. Johnson; Frank Hitzel

ISTFA 2024; 485-491https://doi.org/10.31399/asm.cp.istfa2024p0485

View Articletitled, AFM-in-SEM for Precise Endpoint Delayering of SRAMs

FIB Circuit Edit

Large Area Circuit Delayering from the Backside Using Chemically Assisted Focused Ion Beam Sputtering with Optical Metrology Feedback

Michael DiBattista; Robert Chivas; Jonathan Sheeder; Scott Silverman; Henry Beaulieu

ISTFA 2024; 454-459https://doi.org/10.31399/asm.cp.istfa2024p0454

View Articletitled, Large Area Circuit Delayering from the Backside Using Chemically Assisted Focused Ion Beam Sputtering with Optical Metrology Feedback

Credits

ISTFA 2024; iii-vihttps://doi.org/10.31399/asm.cp.istfa2024fm01

View Articletitled, Credits