1-20 of 51
Proceedings Papers
Close
Title: Yield
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, c1-c67, October 31–November 4, 2021,
...Abstract Abstract Presentation slides from the ISTFA 2021 tutorial, “[Yield Basics for Failure Analysis].” failure analysis DOI: 10.31399/asm.cp.istfa2021tpc1 47th International Symposium for Testing and Failure Analysis Copyright © 2021 About EDFAS and ASM ASM International® All...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 320-323, October 31–November 4, 2021,
.... www.asminternational.org Advanced Soft Defect Screen Methodology for Nano-scale SRAM Yield Improvement Pangyum Kim, Hyungtae Kim, and Youngdae Kim Product & Test Engineering Team, Foundry Division, Samsung Electronics, Hwaseong-si, Korea pan332.kim@samsung.com Abstract As technology scales down, the density of Static...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 394-402, October 31–November 4, 2021,
... and implementation are covered in detail and the capabilities of the method, in terms of false fail discovery, elimination, and failure debug, are demonstrated using actual product test cases. ATPG testing genetic algorithms machine learning pin margin analysis test timing optimization yield improvement...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 38-41, November 15–19, 2020,
... implant diffusion activation. This paper discusses the processes involved in yield delta datamining of FinFET and its advantages over failure characterization, fault localization, nanoprobing, and physical failure analysis. 12nm technology dynamic laser stimulation emission microscopy failure...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 317-322, November 10–14, 2019,
... analysis silicon on insulator Residual EG Oxide in FinFET Analyses and Its Impact to Yield, Product Performance, and Transistor Reliability Pat McGinnis, Dave Albert, Zhigang Song, Johns Oarethu, Phong Tran, John Sylvestri, Greg Hornicek, Mike Tenney IBM Systems: Product Engineering Failure Analysis...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 295-299, October 28–November 1, 2018,
... at wafer SORT functional test. However, upon testing more wafers, it became evident that the wafer center was impacted by abnormal scan logic fallout. The observed yield loss did not correlate with the MIMCAP scribe line Health Of Line (HOL) structures and the failure root cause could not be directly pin...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 544-549, November 5–9, 2017,
... EFA solution for digital circuits and discusses practical considerations in the production yield flow. It provides a brief review of the existing methods and the requirement to build an efficient flow, followed by a discussion on the proposed solution. The proposed solution can be used systematically...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 299-303, November 6–10, 2016,
... Technology Development and Yield Ramp on First Silicon Utilizing a Wafer-Level Dynamic EFA System Li-Qing Chen, Ming-Sheng Sun, Jui-Hao Chao, and Soon Fatt Ng Semiconductor Manufacturing International Corp, Product Test and Failure Analysis, Shanghai, China LiQing_Chen@smics.com, phone +86-21-20810751...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 241-245, November 9–13, 2014,
...Abstract Abstract Process defects, either random or systematic, are often the top killers of any semiconductor device. Process defect learning and reduction are the main focuses in both technology development stage and product manufacturing yield ramp stage. In order to achieve fast defect...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 494-497, November 3–7, 2013,
...Abstract Abstract In-line E-beam inspection may be used for rapid generation of failure analysis (FA) results for low yielding test structures. This approach provides a number of advantages: 1) It is much earlier than traditional FA, 2) de-processing isn’t required, and 3) a high volume...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 582-586, November 3–7, 2013,
... confidence defects representing a known commonality signature to physical failure analysis. 22 nm process automatic test pattern generation back end of line commonality analysis failure analysis logic yield learning vehicles silicon on insulator systematic defects Early Inline Detection...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 602-607, November 3–7, 2013,
.... This calls for a variety of conventional yield analysis techniques to be adopted in parallel to improve the confidence in the RCD results. This paper briefly introduces the RCD analysis and explains how it distinguishes itself from other conventional volume diagnosis analysis techniques. Its typical inputs...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 197-202, November 11–15, 2012,
... and faults in failing IC devices. The case studies illustrate the applications of the method for 28nm flip chip bulk Si CMOS devices and demonstrate how it is used in providing insight into the fab process and design for process and yield improvements. The methods are expected to play an even more important...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 520-525, November 11–15, 2012,
... for logic circuits are not detected and resolved during the technology development stage, they will greatly affect the product manufacturing yield ramp, leading to longer time of design to market. In this paper, we present a logic yield learning methodology based on an inline logic vehicle, which includes...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 526-531, November 11–15, 2012,
...Abstract Abstract Scan chain integrity yield loss is a common concern, especially in early stage of product yield ramp. Typically, scan chain failure diagnosis can only proceed upon full silicon build and structural test. In this work, we propose a proactive methodology which enables failure...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 91-97, November 13–17, 2011,
... of chain fails in order to prevent submitting random defects for failure analysis. Two silicon case studies are presented to validate the production worthiness of diagnosis driven yield analysis for chain fails. The defects uncovered in these case studies are very subtle and would be difficult to identify...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 38-48, November 14–18, 2010,
...Abstract Abstract Yield on specific designs often falls far short of predicted yield, especially at new technology nodes. Product-specific yield ramp is particularly challenging because the defects are, by definition, specific to the design, and often require some degree of design knowledge...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 49-53, November 14–18, 2010,
... to the actual defect. electronic circuits failure analysis fault Isolation laser signal injection microscopy photon emission microscopy Case Study in Fault Isolation of a Metal Short for Yield Enhancement Sarven Ipek, David Grosjean Analog Devices Inc., 831 Woburn St. MS-511, Wilmington MA 01887...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 330-331, November 14–18, 2010,
...Abstract Abstract Driving yield improvement activities to decrease baseline logic / scan yield fallout is often perceived as a challenging or complex activity. Much of this perception is based on yield or device teams historical interactions with the FA teams on these types of requests...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 348-358, November 14–18, 2010,
...Abstract Abstract The authors present a detailed analysis of a full-thickness backside trenching and contact level circuit editing methodology used to achieve a success yield of greater than 90%. The methodology involves both full-thickness backside trenching and contact level circuit...