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Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 240-244, November 15–19, 2020,
... of Ti and Cu are in direct contact, galvanic corrosion can occur in the presence of alkaline solution and discontinuities in the seed Ti layer. We found that galvanic corrosion in the studied system can be further complicated by the existence of copper oxide and titanium oxide as well as Cu and Ti...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 413-417, October 28–November 1, 2018,
...Abstract Abstract This paper describes the investigation of donut-shaped probe marker discolorations found on Al bondpads. Based on SEM/EDS, TEM/EELS, and Auger analysis, the corrosion product is a combination of aluminum, fluorine, and oxygen, implying that the discolorations are due...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 1-6, November 6–10, 2016,
... risks and additional failure mechanisms as backside damage, charging of foils, pad corrosion and sawing residue damages. This paper explains in detail these failure sources, including detailed explanations on root causes and physical mechanisms as well as important hints for failure analysts how...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 287-290, November 6–10, 2016,
.../spec limits, it could cause F-induced corrosion and Al-F defects, resulting in pad discoloration and NSOP problems. In our previous studies [1-5], the theories, characteristics, chemical and physical failure mechanisms and the root causes of the F-induced corrosion and Al-F defects on Al bondpads have...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 613-618, November 6–10, 2016,
... of particle induced corrosion of copper wire bond that resulted in an electrical failure. In the first case, adjacent pin resistive short failures were found to fail due to corrosion and electrochemical migration at wires that were in contact with calcium chloride particles. Analysis showed that the highly...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 619-626, November 6–10, 2016,
... of the Cu-rich IMC, the corrosion resistance of the wire bonding is enhanced and the wire bonding reliability improved. We find that Ni behaves thermodynamically quite similar to Pd in the ternary system of Cu wire bonding, and therefore possesses the potential to improve the corrosion resistance...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 627-629, November 6–10, 2016,
...Abstract Abstract Recently a phenomenon has been found that shows different corrosion rates over Al bond pad regardless of different densities of Cl, F components on Al bond pads in different products. According to the results of analysis, the products showed different corrosion rates...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 278-281, November 1–5, 2015,
...Abstract Abstract In the authors' previous papers, the failure mechanism and elimination solutions of galvanic corrosion (Al-Cu cell) on microchip Al bondpads in the Al process (0.18un and above) have been studied [1-2]. In this paper, the authors will further study the failure mechanism...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 418-423, November 1–5, 2015,
... contact resistance were analyzed and compared, with transmission electron microscopy (TEM), electron diffraction, and energy-dispersive spectroscopy (EDS). The data suggested the corrosion rates were higher for the more Cu-rich Cu-Al intermetallics (IMC) in the failing sample. The corrosion...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 451-454, November 1–5, 2015,
... of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 166-171, November 9–13, 2014,
...-ray spectroscopy, and time-of-flight secondary ion mass spectrometry is reported. It is found that the bond degradation is due to the galvanic corrosion in the Ag-Al bonding area. Specific attention is given to the information of microstructures, elements, and corrosive ions in the degraded bond...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 215-217, November 9–13, 2014,
...Abstract Abstract It is well-known that underetch material, contamination, particle, pinholes and corrosion-induced defects on microchip Al bondpads will cause non-stick on pads (NSOP) issues. In this paper, the authors will further study NSOP problem and introduce one more NSOP failure...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 134-137, November 3–7, 2013,
...Abstract Abstract In wafer fabrication, Fluorine (F) contamination may cause fluorine-induced corrosion and defects on microchip Aluminum (Al) bondpads, resulting in bondpad discoloration or non-stick on pads (NSOP). Auger Electron Spectroscopy (AES) is employed for measurements of the fluorine...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 297-300, November 3–7, 2013,
... as during product release procedures. By applying this measurement method after various life-tests, it has been possible to collect information on degradation in the copper aluminium system which is currently being used to make a model of the corrosion mechanism in the copper aluminium system. bonding...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 438-444, November 3–7, 2013,
...Abstract Abstract Lead-free manufacturing regulations, reduction in circuit board feature sizes and the miniaturization of components to improve hardware performance have combined to make data center IT equipment more prone to attack by corrosive contaminants. Manufacturers are under pressure...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 305-309, November 11–15, 2012,
...Abstract Abstract A case study of Fluorine (F)-outgassing is presented in this paper that caused the corrosion of Aluminum bond pad. It will be shown that the source of F-contamination is not the typical residue left behind after the passivation etch with Fluorine-based gas chemistry...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 310-315, November 11–15, 2012,
..., and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing. aluminum bondpads copper corrosion energy...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 118-126, November 13–17, 2011,
... salt of aluminum. HCl is far less corrosive to Al than HF, leaving a thin chlorinated-oxygenated surface. Immersion of Al thin-films in tetra-methyl-ammonium hydroxide (TMAH) and NH4OH provided non-halogenated surfaces for comparison. With exposure to air, the surface coated with the fluorinated Al...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 308-315, November 13–17, 2011,
... sample mounting. The flat surface greatly increases the mounting efficiency and success rate. For the real case application, a thick Al fluoride oxide layer and Al corrosion were found above the Al bond pads, which had NOSP problem, and their neighbor area, respectively. aluminum fluorides bond...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 117-121, November 14–18, 2010,
...Abstract Abstract Fluorine-induced corrosion is one of the well-known failure modes of Al bondpad leading to non-stick on pad (NSOP) issues. Exposure to moisture (H2O) and atmosphere (O2) play an important role in determining the shape and size of the Al-F corrosion defects on the Al bondpad...