1-20 of 71
Proceedings Papers
Close
Abstract: circuit edit
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 92-96, October 30–November 3, 2022,
... capability of pFIB in discovering the metal buried via void that is easy-to-miss by standard failure analysis (FA) practice. The second utilizes pFIB circuit edit process to facilitate electrical isolation in pinpointing the exact failure location and thus enables identifying the defect more efficiently...
Proceedings Papers

ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 170-175, October 30–November 3, 2022,
... its valuable role in the future of circuit edit. circuit editing direct precursor pulsing hexafluoroacetylacetonate trimethylvinylsilane laser assisted metal deposition polyimide printed circuit board ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing...
Proceedings Papers

ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 176-178, October 30–November 3, 2022,
... Abstract The workflow of backside IC circuit edits using low and high ion-beam energy is investigated. The imaging capabilities using a high keV beam are superior to that of lower beam energy, even when using low beam currents, on typical ion beam microscopes. In this work, we will test...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 122-125, October 31–November 4, 2021,
... editing using ion beam and optical imaging techniques. This provides access to buried conductors and creates probe points for measurements that can be made using an optical, electron beam, or mechanical micro/nano prober. backside circuit editing focused ion beam image sensor photon imaging...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 70-74, November 15–19, 2020,
... case where brightness alone is insufficient to tell leakage location. In this study, propose a simple technique using platinum (Pt) marking as a circuit edit (CE) technique to alter metal PVC to identify the actual leakage location. Conventional SEM and PVC contrast imaging are unable to pinpoint exact...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 122-128, November 15–19, 2020,
... Abstract Focused Ion Beam (FIB) chip circuit editing is a well-established highly specialized laboratory technique for making direct changes to the functionality of integrated circuits. A precisely tuned and placed ion beam in conjunction with process gases selectively uncovers internal...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 129-132, November 15–19, 2020,
... Abstract The characterization of Back Side Illumination (BSI) Image Sensor is challenging because of its unique construct with silicon on top. A novel approach for the BSI Image sensor characterization will be presented in this paper. The proposed approach utilizes the circuit editing through...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 204-208, November 10–14, 2019,
... Abstract Focused Ion Beam (FIB) circuit edit allows for rapid prototyping of potential semiconductor design changes without the need to run a full manufacturing cycle in a semiconductor Fab. By FIB editing a completed module, thorough testing on the bench or in a full system can be achieved...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 445-453, November 10–14, 2019,
... Abstract Backside silicon removal provides an avenue for a number of modern non-destructive and circuit edit techniques. Visible light microscopy, electron beam microscopy, and focused ion beam circuit edit benefit from a removal of back side silicon from the integrated circuit being examined...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 206-208, October 28–November 1, 2018,
... Abstract Secondary electron detector (SED) plays a vital role in a focused ion beam (FIB) system. A successful circuit edit requires a good effective detector. Novel approach is presented in this paper to improve the performance of such a detector, making circuit altering for the most advanced...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 219-223, October 28–November 1, 2018,
... Abstract In the semiconductor chip manufacturing industry, a method of evaluating characteristics by applying a direct circuit edit at an already manufactured chip level is widely used in order to shorten the product development time and release the product to the market in a short time. [1...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 238-245, November 5–9, 2017,
... Abstract This paper describes a circuit editing procedure in which the authors used a gallium column Focused Ion Beam (FIB) tool to divide a merged 32nm multi-finger planar transistor into two separate operating components. Rather than rely on live imaging or the various endpoint detection...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 246-250, November 5–9, 2017,
... Abstract Backside circuit edit (CE) remains a crucial failure analysis (FA) capability, enabling design modifications on advanced integrated circuits. [1-9] A key requirement of this activity is to approach the active transistor layer of the silicon through the removal of the silicon substrate...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 251-255, November 5–9, 2017,
... devices on advanced technology nodes. Said limitations are fueling interest in exploring alternative primary species and ion beam technologies for circuit edit applications. Exploratory tests of etching typical semiconductor materials with Xe ion beams generated from two plasma ion sources confirmed...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 411-415, November 5–9, 2017,
... focused ion beam circuit edit. By doing so, the design specifications of high gain and low noise of the LNA are reliably met at high yield for the desired operating frequency. The presented DFFA method enables a shift in peak gain by 2.5 GHz. It thereby improves gain and noise figure at 24 GHz by 2 dB...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 456-463, November 5–9, 2017,
... in conjunction with traditional methods. As introduction, we have provided some interesting case studies whereby EBIC/EBAC have been used in conjunction with FIB circuit edits and scan diagnostic results to narrow the defect search areas. We focus the paper on some less common applications of cross sectional...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 204-207, November 6–10, 2016,
... Abstract Post silicon validation techniques specifically Focused Ion Beam (FIB) circuit editing and Failure Analysis (FA) require sample preparation on Integrated Circuits (IC). Although these preparation techniques are typically done globally across the encapsulated and silicon packaging...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 391-396, November 6–10, 2016,
... Abstract Shrinking transistor geometries present ongoing challenges for backside FIB circuit edit operations. The available space to gain access to critical signal lines has diminished to the order of hundreds of nanometers. Several previous works have shown that the diffusion of active devices...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 397-401, November 6–10, 2016,
... suitable platform for selective removal of materials in circuit edit application. chemical etching failure analysis focused ion beam gas-assisted etching inductively coupled plasma ion source integrated circuit editing ion implantation silicon dioxide etching xenon difluorides Optimizing...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 402-405, November 6–10, 2016,
... Abstract This paper offers an alternative solution in dealing with Focused Ion Beam (FIB) circuit edit debug of RF products that often required soldering the device onto a test board to enable sensitive RF characterization. Performing FIB circuit edit while the device is soldered on a test...